Intelligent full automation controlled flow for a semiconductor furnace tool

• US 20050187647A1
• Filed: 02/19/2004
• Published: 08/25/2005
• Est. Priority Date: 02/19/2004
• Status: Abandoned Application

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Wang, Kuo-Hua, Chen, Shun-An
• Application Number:
  US10/782,037
• Publication Number:
  US 20050187647A1
• Time in Patent Office: Days
• US Class Current: 700/100
• CPC Class Codes: H01L 21/67276 Production flow monitoring, e.g. for increasing throughput program-control systems per se G05B19/00, e.g. total factory control G05B19/418
• CPC Class Codes: H01L 21/67757 vertical transfer of a batch of workpieces

Abstract

The present invention relates to an apparatus and method for processing the flow of semiconductor wafers through a furnace tool having a front-opening unified pod (FOUP) material handling system. The invention provides for an automated control flow to realize greater efficiency and assure process quality. In one aspect of the invention the wafer batch completing its operation is discharged simultaneous with the charging of the next batch. Essentially the operation takes place by overlapping processing operations. An embodiment of the invention includes a process comprising the steps of: providing a first batch of semiconductor material, and loading the first batch into a carrier which transports the first batch into a semiconductor manufacturing process, and while the first batch undergoes the process, forming a second batch of semiconductor material, and pausing a second batch process operation until the first batch completes processing, to reduce the idle time of said process.

Claims

1. A process comprising the steps of:

providing a first batch of semiconductor material, and loading the first batch into a carrier for transport into a semiconductor manufacturing process, and while the first batch undergoes the manufacturing process, providing a second batch of semiconductor material, and pausing a second batch process operation until the first batch completes processing, to reduce the idle time of said process.

2. A process comprising the steps of:

loading a first batch of semiconductor material into a carrier and installing the first batch in a process chamber and while the first batch is in the chamber charging the carrier with a second batch of semiconductor material, and pausing further operation of the second batch, while inspecting the first batch.

3. The process according to claim 2, further comprising the step of:

determining if the inspection is satisfactory.

4. The process according to claim 2, further comprising the step of:

determining if the inspection is unsatisfactory.

5. The process according to claim 2, further comprising the step of:

determining when to resume operation.

6. The method according to claim 2, further comprising the step of:

determining when to resume operation, based upon the result of the inspection of the first batch.

7. A process comprising the steps of:

loading a second batch of semiconductor material into a conveyor and installing the second batch in a process chamber before a first batch of semiconductor material has been processed and cooled.

8. A process adapted to heat and cool a substrate comprising the steps of:

forming a first batch of semiconductor material, and loading the first batch into a carrier, transferring the first batch to a heating mechanism, forming a second batch of semiconductor material, and loading the second batch into the carrier, while heating the first batch positioned within the heating mechanism;

transferring the first batch between a position proximate the heating mechanism and a position proximate the coolable member, cooling the first batch positioned proximate within a cooling mechanism; and

while the first batch completes the process, transferring the second batch to the heating mechanism, to reduce the idle time of the process.