Fluidic apparatus and method for cooling a non-uniformly heated power device

• US 20050189089A1
• Filed: 02/27/2004
• Published: 09/01/2005
• Est. Priority Date: 02/27/2004
• Status: Abandoned Application

• Current Assignee: Nanocoolers, Inc.
• Original Assignee: Nanocoolers, Inc.
• Inventors: Miner, Andrew
• Application Number:
  US10/789,205
• Publication Number:
  US 20050189089A1
• Time in Patent Office: Days
• US Class Current: 165/80.400
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A fluidic apparatus and method for cooling a non-uniformly heated heat source such as an integrated circuit. The apparatus preferentially cools a non-uniformly heated integrated circuit. A coolant is introduced into a high-power region of the integrated circuit through an inlet. The coolant absorbs heat from this region and cools it. Thereafter, the coolant is transferred to the low-power region of the integrated circuit. After the coolant absorbs heat from the low-power region, it is removed from an outlet, which is connected to the low-power region of the integrated circuit.

Claims

1. An apparatus for cooling a non-uniformly heated integrated circuit, the integrated circuit having at least one low-power region and at least one high-power region, the apparatus comprising:

a. at least one inlet for a coolant, the inlet being connected with a high-power region of the integrated circuit;

b. means for transferring the coolant from the high-power region to a low-power region of the integrated circuit; and

c. at least one outlet for the coolant, the outlet being connected to the low-power region of the integrated circuit.

2. The apparatus as recited in claim 1 wherein the coolant is a single phase coolant.

3. The apparatus as recited in claim 1 wherein the coolant is a two phase coolant.

4. The apparatus as recited in claim 1 wherein the means for transferring the coolant comprises a chamber, the chamber being connected to the inlet and the outlet, the chamber being in close contact with the integrated circuit.

5. The apparatus as recited in claim 4 wherein the chamber is made of high thermal conductivity material.

6. The apparatus as recited in claim 4 wherein the chamber has channels for directing the coolant.

7. The apparatus as recited in claim 1 further comprising a pump for introducing the coolant into the integrated circuit, transferring the coolant from the high-power region to the low-power region of the integrated circuit and removing the coolant from the integrated circuit.

8. A method for cooling a non-uniformly heated integrated circuit, the integrated circuit having at least one low-power region and at least one high-power region, the method comprising the steps of:

a. introducing a coolant in a high-power region of the integrated circuit;

b. transferring the coolant from the high-power region to a low-power region of the integrated circuit; and

c. removing the coolant from the low-power region of the integrated circuit.

9. The method as recited in claim 8 wherein the coolant is introduced parallel to the plane of the integrated circuit.

10. The method as recited in claim 8 wherein the coolant is introduced perpendicular to the plane of the integrated circuit.

11. An apparatus for cooling a non-uniformly heated integrated circuit, the integrated circuit having at least one low-power region, at least one moderate power region and at least one high-power region, the apparatus comprising:

a. at least one inlet for a coolant, the inlet being connected with a high-power region of the integrated circuit;

b. means for transferring the coolant from the high-power region to a moderate power region of the integrated circuit;

c. means for transferring the coolant from the moderate power region to a low-power region of the integrated circuit; and

d. at least one outlet for the coolant, the outlet being connected to the low-power region of the integrated circuit.

12. A method for cooling a non-uniformly heated integrated circuit, the integrated circuit having at least one low-power region, at least one moderate power region and at least one high-power region, the method comprising the steps of:

a. introducing a coolant in a high-power region of the integrated circuit;

b. transferring the coolant from the high-power region to a moderate power region of the integrated circuit;

c. transferring the coolant from the moderate power region to a low-power region of the integrated circuit; and

d. removing the coolant from the low-power region of the integrated circuit.

13. An apparatus for cooling a non-uniformly heated heat source, the heat source having at least one low-power region and at least one high-power region, the apparatus comprising:

a. at least one inlet for a coolant, the inlet being connected with a high-power region of the heat source;

b. means for transferring the coolant from the high-power region to a low-power region of the heat source; and

c. at least one outlet for the coolant, the outlet being connected to the low-power region of the heat source.

14. A method for cooling a non-uniformly heated heat source, the heat source having at least one low-power region and at least one high-power region, the method comprising the steps of:

a. introducing a coolant in a high-power region of the heat source;

b. transferring the coolant from the high-power region to a low-power region of the heat source; and

c. removing the coolant from the low-power region of the heat source.