Miniature fluid-cooled heat sink with integral heater

• US 20050189342A1
• Filed: 02/23/2004
• Published: 09/01/2005
• Est. Priority Date: 02/23/2004
• Status: Abandoned Application

• Current Assignee: Delta Design Incorporated (COHU Incorporated)
• Original Assignee: Delta Design Incorporated (COHU Incorporated)
• Inventors: Kabbani, Samer
• Application Number:
  US10/785,204
• Publication Number:
  US 20050189342A1
• Time in Patent Office: Days
• US Class Current: 219/494
• CPC Class Codes: F28F 2260/02 having microchannels
• CPC Class Codes: F28F 3/086 having one or more openings therein forming tubular heat-exchange passages
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A temperature control device that includes a miniature liquid-cooled heat sink with integral heater and sensing elements is used as part of a system to provide a controlled temperature surface to an electronic device, such as a semiconductor device, during the testing phase. The temperature control device includes an interface surface configured to provide a thermal path from the device to a device under test. One such device has a liquid-cooled heat sink comprising a first heat transfer portion in a first plane and a second heat transfer portion in a second plane. The first and second heat transfer portions establish a three-dimensional cross-flow of coolant within the heat sink structure. An alternate embodiment includes parallel fluid conduits, each having a three-dimensional microchannel structure that directs coolant flow in three dimensions within the fluid conduits. Coolant flows in opposite directions through adjacent fluid conduits, thus resulting in a three-dimensional cross-flow within the heat sink structure.

Claims

1. A temperature control device comprising:

an interface surface configured to provide a thermal path to a device under test (“

DUT”

);

a fluid-cooled heat sink having a first heat transfer portion in a first plane and a second heat transfer portion in a second plane, said first plane being closer to said interface surface than said second plane; and

one or more integral heater assemblies.

2. A temperature control device according to claim 1, further comprising one or more thermal sensing elements.

3. A temperature control device according to claim 1, wherein said first heat transfer portion includes one or more flow channels and said second heat transfer portion includes one or more flow channels.

4. A temperature control device according to claim 1, wherein said first heat transfer portion has a flow path in a first direction and said second heat transfer portion has a flow path in a second direction.

5. A temperature control device according to claim 4, wherein said flow path in said first direction is opposite to said flow path in said second direction.

6. A temperature control device according to claim 1, wherein said one or more integral heater assemblies are planar and parallel to said interface surface.

7. A temperature control device according to claim 1, wherein said one or more integral heater assemblies includes a substrate and at least one heating element formed on said substrate.

8. A temperature control device according to claim 7, wherein said at least one heating element comprises one or more electrically resistive serpentine traces.

9. A temperature control device according to claim 1, wherein each of said one or more integral heater assemblies has an independently adjustable power level.

10. A temperature control device comprising:

an interface surface configured to provide a thermal path to a device under test (“

DUT”

);

a fluid-cooled heat sink structure configured to maintain a cross-flow of coolant in three dimensions for cooling said interface surface; and

a heater assembly configured to heat said interface surface.

11. A temperature control device according to claim 10, wherein said fluid-cooled heat sink structure comprises:

a first fluid conduit for accommodating coolant flow in a first direction;

a first three-dimensional microchannel structure located within said first fluid conduit, said first microchannel structure being configured to direct coolant flow in three dimensions within said first fluid conduit;

a second fluid conduit for accommodating coolant flow in a second direction different than said first direction; and

a second three-dimensional microchannel structure located within said second fluid conduit, said second microchannel structure being configured to direct coolant flow in three dimensions within said second fluid conduit.

12. A temperature control device according to claim 11, wherein said first and second fluid conduits are coplanar.

13. A temperature control device according to claim 12, wherein said first and second fluid conduits are adjacent to each other.

14. A temperature control device according to claim 11, wherein:

said first fluid conduit is located above said second fluid conduit; and

said first and second fluid conduits are located above said interface surface.

15. A temperature control device according to claim 10, wherein said heater assembly is located between said interface surface and said fluid-cooled heat sink structure.

16. A temperature control device according to claim 10, wherein said fluid-cooled heat sink structure comprises:

a first layer;

a second layer below said first layer;

a first plurality of flow channels, formed in said first layer, for accommodating coolant flow within said fluid-cooled heat sink structure; and

a second plurality of flow channels, formed in said second layer, for accommodating coolant flow within said fluid-cooled heat sink structure.

17. A temperature control device according to claim 16, wherein said first and second layers are parallel to each other.

18. A temperature control device according to claim 16, wherein:

said first plurality of flow channels are configured to maintain a first flow path having a first direction; and

said second plurality of flow channels are configured to maintain a second flow path having a second direction different than said first direction.

19. A temperature control device according to claim 18, wherein said first flow path is opposite to said second flow path.

20. A temperature control device comprising:

an interface surface configured to provide a thermal path to a device under test (“

DUT”

); and

a fluid-cooled heat sink structure configured to maintain a cross-flow of coolant in three-dimensions for cooling said interface surface, said fluid-cooled heat sink structure comprising;

a first fluid conduit for accommodating coolant flow in a first direction;

a first three-dimensional microchannel structure located within said first fluid conduit, said first microchannel structure being configured to direct coolant flow in three dimensions within said first fluid conduit;

a second fluid conduit for accommodating coolant flow in a second direction different than said first direction; and

a second three-dimensional microchannel structure located within said second fluid conduit, said second microchannel structure being configured to direct coolant flow in three dimensions within said second fluid conduit.

21. A temperature control device according to claim 20, further comprising a heater assembly configured to heat said interface surface.

22. A temperature control device according to claim 20, wherein said first and second fluid conduits are coplanar.

23. A temperature control device according to claim 20, wherein:

said first fluid conduit is located above said second fluid conduit; and

said first and second fluid conduits are located above said interface surface.