Optoelectronic arrangement

• US 20050189473A1
• Filed: 02/27/2004
• Published: 09/01/2005
• Est. Priority Date: 02/27/2004
• Status: Active Grant

• Current Assignee: II-VI Delaware, Inc. (Coherent Corp.)
• Original Assignee: Finisar Corporation (II-VI Incorporated)
• Inventors: Schrodinger, Dipl.-Ing. Karl
• Granted Patent: US 7,245,648 B2
• Time in Patent Office: Days
• US Class Current: 250/214.100
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10158 at the passive surface
• CPC Class Codes: H01L 31/147 the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
• CPC Class Codes: H01S 5/0234 Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings
• CPC Class Codes: H01S 5/02345 Wire-bonding
• CPC Class Codes: H01S 5/0237 by soldering
• CPC Class Codes: H01S 5/0683 by monitoring the optical output parameters
• CPC Class Codes: H01S 5/18305 with emission through the substrate, i.e. bottom emission
• CPC Class Codes: H01S 5/423 having a vertical cavity

Abstract

The invention relates to an optoelectronic arrangement having at least one optoelectronic emission component and a monitor component operatively coupled to the emission component to detect at least some radiation radiated by the emission component. A driver circuit of the arrangement is electrically connected to the emission component and the monitor component and a carrier substrate. In this case, the driver circuit is formed as a circuit integrated into the carrier substrate. The monitor component is likewise integrated into the carrier substrate and the emission component is formed as a separate structural part and is arranged on the carrier substrate.

Claims

1. An optoelectronic arrangement, comprising:

at least one emission component,

a monitor component, which is operatively coupled to the emission component and detects at least some radiation radiated by the emission component,

a driver circuit electrically connected to the emission component and the monitor component, and

a carrier substrate,

the driver circuit being formed as a circuit integrated into the carrier substrate,

the monitor component likewise being integrated into the carrier substrate, and

the emission component being formed as a separate structural part and being arranged on the carrier substrate.

2. The arrangement according to claim 1, the monitor component comprising a photodiode having a pn junction integrated into the carrier substrate.

3. The arrangement according to claim 1, the emission component comprising a vertically emitted laser component which is fixed above the monitor component on the carrier substrate, part of the laser light being radiated upward and part of the laser light being radiated downward onto the monitor component.

4. The arrangement according to claim 3,

the laser component comprising a laser substrate and a laser resonator,

the laser resonator being arranged at a side of the laser component which is remote from the carrier substrate, and

the laser substrate having, at a side facing the carrier substrate and in a manner adjoining the laser resonator, a cutout in such a way that downwardly radiated light falls onto the monitor component.

5. The arrangement according to claim 3,

the laser component comprising a laser substrate and a laser resonator,

the laser resonator being arranged at a side of the laser component which faces the carrier substrate, and

the laser substrate having, at a side remote from the carrier substrate and in a manner adjoining the laser resonator, a cutout that facilitates radiating light away from the carrier substrate.

6. The arrangement according to claim 5, the laser component being arranged with a top side facing toward the carrier substrate and in this case having one or more electrical contacts located at the top side.

7. The arrangement according to claim 1, the emission component being formed as a laser chip.

8. The arrangement according to claim 1, the emission component being connected to the carrier substrate by at least one of adhesive bonding and wire bonding.

9. The arrangement according to claim 1, the emission component being connected to the carrier substrate by flip-chip mounting.

10. The arrangement according to claim 3, further comprising an array of vertically emitting laser components and respectively assigned monitor components, wherein at least some of the laser light from the respective laser components is radiated upward and some of the laser light is radiated downward onto the associated monitor components.

11. The arrangement according to claim 10,

the array of vertically emitting laser components having a common laser substrate and respective laser resonators for the laser components,

the respective laser resonators being arranged at respective sides of the laser components that faces the carrier substrate, and

respective laser substrates for the laser components having, at a side remote from the carrier substrate and in a manner adjoining the laser resonators, respective cutouts that facilitate radiating light away from the carrier substrate.

12. The arrangement according to claim 10, the laser components of the array being connected as redundant components.

13. The arrangement according to claim 3, the carrier substrate being transparent to the radiated light.

14. The arrangement according to claim 3, the emission component emitting light having a wavelength of between 650 and 850 nm.

15. The arrangement according to claim 14, wherein the emission component comprises GaAs.

16. The arrangement according to claim 1, wherein the emission component comprises a vertically emitting laser component (VCSEL).

17. The arrangement according to claim 1, wherein the driver circuit is integrated monolithically into the carrier substrate.

18. The arrangement according to claim 1, wherein the monitor component is integrated monolithically into the carrier substrate.

19. The arrangement according to claim 1, wherein the monitor component comprises a diode.

20. The arrangement according to claim 19, wherein the emission component comprises a laser chip, the diode being integrated monolithically into the carrier substrate and the laser chip being located on the carrier substrate above the diode.