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Apparatus and methods for cooling semiconductor integrated circuit package structures

  • US 20050189568A1
  • Filed: 02/27/2004
  • Published: 09/01/2005
  • Est. Priority Date: 02/27/2004
  • Status: Active Grant
First Claim
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1. A semiconductor package, comprising:

  • a semiconductor chip having a plurality of first thermal fins on a non-active surface of the semiconductor chip, wherein the first thermal fins longitudinally extend across the non-active surface of the semiconductor;

    a heat conducting device having a plurality of second thermal fins on a mating surface of the heat conducting device, wherein the second thermal fins longitudinally extend across the mating surface of the heat conducting device; and

    a thermal joint formed between the non-active surface of the semiconductor chip and the mating surface of the heat conducting device, the thermal joint comprising a plurality of interdigitated thermal fins separated by a compliant thermally conductive material, wherein the interdigitated thermal fins comprise the first and second thermal fins, and wherein a gap size between the interdigitated thermal fins of the thermal joint varies across the thermal joint.

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