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Electronic component products and method of manufacturing electronic component products

  • US 20050189657A1
  • Filed: 02/28/2005
  • Published: 09/01/2005
  • Est. Priority Date: 01/16/1998
  • Status: Active Grant
First Claim
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1. A ball array device produced according to a process comprising:

  • combining an electronic circuit with a ball array package having a plurality of balls;

    making a three dimensional inspection of a lead on the ball array package with the ball grid array device being positioned in a fixed optical system; and

    selecting the combination of the electronic circuit and the ball array package as a produced ball array device based upon the results of the three dimensional inspection;

    wherein the three dimensional inspection comprises;

    illuminating the ball array package;

    taking a first image of the ball array package with a first camera disposed in a fixed focus position relative to the ball array package to obtain a characteristic circular doughnut shape image from at least one ball;

    taking a second image of the ball array package with a second camera disposed in a fixed focus position relative to the ball array package to obtain a side view image of the at least one ball; and

    processing the first image and the second image using a triangulation method to calculate a three dimensional position of the at least one ball with reference to a pre-calculated calibration plane.

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