Piezoelectric device mounted on integrated circuit chip
First Claim
1. An integrated circuit system configured for containment within an implantable electronic microdevice, said microdevice having an axial dimension of less than 60 mm and a lateral dimension of less than 6 mm and at least two electrodes for communicating electrical signals between said microdevice and living tissue;
- said integrated circuit comprising;
an integrated circuit chip containing an electronic circuit;
an electromechanical resonator cantilever mounted to and supported by said integrated circuit chip and electrically coupled to said electronic circuit; and
said cantilever mounted resonator supported with an additional support that comprises a soft, flexible mounting material.
1 Assignment
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Accused Products
Abstract
An electronics filter circuit includes an electromechanical resonator that is mounted directly to the surface of a silicon integrated circuit, rather than being a surface mounted or leaded filter can on a circuit board. This filter circuit allows the integrated circuit electronic package to be significantly smaller than a conventional electromechanical resonator package. The electromechanical resonator may be protected during processing and during use with a protective cover that is made of a material such as titanium. The protective cover is attached to the integrated circuit chip.
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Citations
17 Claims
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1. An integrated circuit system configured for containment within an implantable electronic microdevice, said microdevice having an axial dimension of less than 60 mm and a lateral dimension of less than 6 mm and at least two electrodes for communicating electrical signals between said microdevice and living tissue;
- said integrated circuit comprising;
an integrated circuit chip containing an electronic circuit;
an electromechanical resonator cantilever mounted to and supported by said integrated circuit chip and electrically coupled to said electronic circuit; and
said cantilever mounted resonator supported with an additional support that comprises a soft, flexible mounting material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
- said integrated circuit comprising;
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13. A method of forming a circuit on an integrated circuit chip for containment within a microdevice having an axial dimension of less than 60 mm and a lateral dimension of less than 6 mm, comprising the steps of:
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selecting an integrated circuit chip, selecting at least one electromechanical resonator, forming at least one mounting pad on said integrated circuit chip, and attaching at least one electromechanical resonator to said mounting pad. - View Dependent Claims (14, 15, 16, 17)
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Specification