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Novel radio frequency (RF) circuit board topology

  • US 20050190614A1
  • Filed: 03/01/2004
  • Published: 09/01/2005
  • Est. Priority Date: 03/01/2004
  • Status: Active Grant
First Claim
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1. In a radio frequency circuit, an interconnection structure to connect a first conductive trace on a first conductive layer of a circuit board to a second conductive trace on a second conductive layer of the circuit board, the interconnection structure comprising:

  • a centre signal conductor via connected at a first end to the first conductive trace and connected at a second end to the second conductive trace and wherein the signal conductor via propagates electrical signals between the first conductive trace on the first conductive layer and the second conductive trace on the second conductive layer of the circuit board; and

    a plurality of ground vias surrounding the centre signal conductor via, the plurality of ground vias having a position relative to the centre signal conductor via based upon a desired overall impedance of the interconnection structure.

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