Electronic component products made according to a process that includes a method for three dimensional inspection
First Claim
1. A ball grid array (BGA) device produced according to a process comprising:
- placing an electronic circuit into a BGA package;
making a three dimensional inspection of a lead on the BGA package; and
selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection;
wherein the three dimensional inspection comprises;
illuminating the lead;
providing fixed optical elements to obtain both a bottom view of the lead and a side perspective view of the lead;
receiving at least the bottom view and the side perspective view of the lead using a single camera;
transmitting the bottom view and the side perspective view of the lead to memory as pixel values;
determining a first lead reference pixel position in the bottom view;
determining a second lead reference pixel position in the side view; and
converting the first and second lead reference pixel positions into a world value by using pixel values and parameters determined during a calibration.
3 Assignments
0 Petitions
Accused Products
Abstract
A calibration and part inspection method for the inspection of ball grid array, BGA, devices. One or more cameras image a precision pattern mask with dot patterns deposited on a transparent reticle. The precision pattern mask is used for calibration of the system. A light source and overhead light reflective diffuser provide illumination. A camera images the reticle precision pattern mask from directly below. An additional mirror or prism located below the bottom plane of the reticle reflects the reticle pattern mask from a side view, through prisms or reflective surfaces, into the camera. By imaging more than one dot pattern the missing state values of the system can be resolved using a trigonometric solution. The reticle with the pattern mask is removed after calibration and the BGA to be inspected is placed with the balls facing downward, in such a manner as to be imaged by a single camera, or optionally, via additional cameras. The scene of the part can thus be triangulated and the dimensions of the BGA are determined.
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Citations
125 Claims
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1. A ball grid array (BGA) device produced according to a process comprising:
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placing an electronic circuit into a BGA package;
making a three dimensional inspection of a lead on the BGA package; and
selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection;
wherein the three dimensional inspection comprises;
illuminating the lead;
providing fixed optical elements to obtain both a bottom view of the lead and a side perspective view of the lead;
receiving at least the bottom view and the side perspective view of the lead using a single camera;
transmitting the bottom view and the side perspective view of the lead to memory as pixel values;
determining a first lead reference pixel position in the bottom view;
determining a second lead reference pixel position in the side view; and
converting the first and second lead reference pixel positions into a world value by using pixel values and parameters determined during a calibration. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A ball grid array (BGA) device produced according to a process comprising:
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placing an electronic circuit into a BGA package;
making a three dimensional inspection of a lead on the BGA package; and
selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection;
wherein the three dimensional inspection comprises;
illuminating the lead;
providing fixed optical elements to obtain both a bottom view of the lead and a side perspective view of the lead;
receiving at least the bottom view and the side perspective view of the lead using a single camera;
transmitting the bottom view and the side perspective view of the lead to memory as pixel values;
determining a first lead reference pixel position in the bottom view;
determining a second lead reference pixel position in the side view; and
converting the first lead reference pixel position into a first world value and the second lead reference pixel position into a second world value by using pixel values and parameters determined during a calibration. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A ball grid array (BGA) device produced according to a process comprising:
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combining an electronic circuit with a BGA package having a plurality of balls;
making a three dimensional inspection of a lead on the BGA package with the ball grid array device being positioned in an optical system; and
selecting the combination of the electronic circuit and the BGA package as a produced BGA device based upon the results of the three dimensional inspection;
wherein the three dimensional inspection comprises;
illuminating at least one ball on the BGA package using a fixed illumination system;
disposing a single sensor, a first optical element and a second optical element in relation to the BGA package so that the sensor obtains at least two differing views of the at least one ball, the sensor providing output representing the at least two differing views; and
processing the output using a triangulation method to calculate a three dimensional position of the at least one ball with reference to a pre-calculated calibration plane. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35)
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36. A ball grid array (BGA) device produced according to a process comprising:
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combining an electronic circuit with a BGA package having a plurality of balls;
making a three dimensional inspection of a lead on the BGA package with the ball grid array device being positioned in an optical system; and
selecting the combination of the electronic circuit and the BGA package as a produced BGA device based upon the results of the three dimensional inspection;
wherein the three dimensional inspection comprises;
illuminating the BGA package using a fixed illumination system;
disposing a single sensor to receive light at a first angle relative to the BGA package;
positioning a first optical element to transmit light to the sensor, where the sensor obtains a first view of the BGA package;
disposing a second optical element to receive light at a second angle different from the first angle and to provide a second view of the BGA package to the sensor;
transmitting image information from the sensor; and
processing the image information by applying triangulation calculations to measurements of the image information so as to calculate a three dimensional position of at least one ball with reference to a pre-calculated calibration plane. - View Dependent Claims (37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49)
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50. A ball grid array (BGA) device produced according to a process comprising:
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combining an electronic circuit with a BGA package having a plurality of balls;
making a three dimensional inspection of a lead on the BGA package with the ball grid array device being positioned in an optical system; and
selecting the combination of the electronic circuit and the BGA package as a produced BGA device based upon the results of the three dimensional inspection;
wherein the three dimensional inspection comprises;
illuminating the BGA package using a fixed illumination system;
taking a first image of the BGA package with a single camera disposed in a fixed focus position relative to the BGA package to obtain a circular doughnut shape image from at least one ball;
taking a second image of the BGA package with an optical element disposed in a fixed focus position relative to the BGA package to transmit a side view image of the at least one ball to the camera; and
processing the first image and the second image using a triangulation method to calculate a three dimensional position of the at least one ball with reference to a pre-calculated calibration plane. - View Dependent Claims (51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65)
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66. A ball grid array (BGA) device produced according to a process comprising:
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placing an electronic circuit into a BGA package;
making a three dimensional inspection of a lead on the BGA package; and
selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection;
wherein the three dimensional inspection comprises;
illuminating the lead;
providing fixed optical elements to obtain two differing views of the lead;
disposing at least one sensor to obtain the two differing views of the lead;
transmitting the two differing views of the lead to memory;
determining a first lead reference position in a first view;
determining a second lead reference position in a second view; and
converting the first and second lead reference positions into a world value by using parameters determined during a calibration. - View Dependent Claims (67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, 100, 101, 102, 103, 104, 105, 106, 107, 108, 109, 110, 111, 112, 113, 114, 115)
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116. A ball grid array (BGA) device produced according to a process comprising:
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placing an electronic circuit into a BGA package;
making a three dimensional inspection of a lead on the BGA package; and
selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection;
wherein the three dimensional inspection comprises;
illuminating the lead with a ring light and a side light;
providing fixed optical elements to obtain two differing views of the lead;
disposing at least one sensor to obtain the two differing views of the lead;
transmitting the two differing views of the lead to memory;
determining a first lead reference position in a first view;
determining a second lead reference position in a second view; and
converting the first and second lead reference positions into a world value by using parameters determined during a calibration.
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117. A ball grid array (BGA) device produced according to a process comprising:
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placing an electronic circuit into a BGA package;
making a three dimensional inspection of a lead on the BGA package; and
selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection;
wherein the three dimensional inspection comprises;
illuminating the lead with a ring light and a side light;
providing fixed optical elements to obtain two differing views of the lead;
disposing at least one sensor to obtain the two differing views of the lead;
transmitting the two differing views of the lead to memory;
determining a first lead reference position in a first view;
determining a second lead reference position in a second view; and
converting the first and second lead reference positions into a world value by using the locations of a calibration pattern stored in memory.
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118. A ball grid array (BGA) device produced according to a process comprising:
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placing an electronic circuit into a BGA package;
making a three dimensional inspection of a lead on the BGA package; and
selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection;
wherein the three dimensional inspection comprises;
illuminating the lead;
providing fixed optical elements to obtain a first view of the lead that comprises a segment having a donut shape and a second view of the lead that comprises a segment having a crescent shape;
disposing at least one sensor to obtain the first and second views of the lead;
transmitting the two differing views of the lead to memory;
determining a first lead reference position in a first view;
determining a second lead reference position in a second view; and
converting the first and second lead reference positions into a world value by using the locations of a calibration pattern stored in memory.
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119. A ball grid array (BGA) device produced according to a process comprising:
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placing an electronic circuit into a BGA package;
making a three dimensional inspection of a lead on the BGA package; and
selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection;
wherein the three dimensional inspection comprises;
illuminating the lead;
providing fixed optical elements to obtain a first view of the lead that comprises a segment having a donut shape and a second view of the lead that comprises a segment having a crescent shape;
disposing at least one sensor to obtain the first and second views of the lead;
transmitting the two differing views of the lead to memory;
determining a first lead reference position in a first view;
determining a second lead reference position in a second view; and
converting the first and second lead reference positions into an X, Y, and Z world value by using the locations of a calibration pattern stored in memory.
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120. A ball grid array (BGA) device produced according to a process comprising:
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placing an electronic circuit into a BGA package;
making a three dimensional inspection of a lead on the BGA package; and
selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection;
wherein the three dimensional inspection comprises;
illuminating the lead with a ring light and a side light;
providing fixed optical elements to obtain two differing views of the lead;
disposing a single sensor to obtain the two differing views of the lead;
transmitting the two differing views of the lead to memory;
determining a first lead reference position in a first view;
determining a second lead reference position in a second view; and
converting the first and second lead reference positions into a world value by using parameters determined during a calibration.
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121. A ball grid array (BGA) device produced according to a process comprising:
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placing an electronic circuit into a BGA package;
making a three dimensional inspection of a lead on the BGA package; and
selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection;
wherein the three dimensional inspection comprises;
illuminating the lead with a ring light and a side light that are spectrally diverse from one another;
providing fixed optical elements to obtain two differing views of the lead;
disposing a single sensor to obtain the two differing views of the lead;
transmitting the two differing views of the lead to memory;
determining a first lead reference position in a first view;
determining a second lead reference position in a second view; and
converting the first and second lead reference positions into a world value by using parameters determined during a calibration.
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122. A ball grid array (BGA) device produced according to a process comprising:
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placing an electronic circuit into a BGA package;
making a three dimensional inspection of a lead on the BGA package; and
selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection;
wherein the three dimensional inspection comprises;
illuminating the lead with a ring light and a side light;
providing fixed optical elements to obtain two differing views of the lead;
disposing a single one sensor to obtain the two differing views of the lead;
transmitting the two differing views of the lead to memory;
determining a first lead reference position in a first view;
determining a second lead reference position in a second view; and
converting the first and second lead reference positions into a world value by using the locations of a calibration pattern stored in memory.
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123. A ball grid array (BGA) device produced according to a process comprising:
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placing an electronic circuit into a BGA package;
making a three dimensional inspection of a lead on the BGA package; and
selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection;
wherein the three dimensional inspection comprises;
illuminating the lead with a ring light and a side light;
providing fixed optical elements to obtain two differing views of the lead;
disposing a single one sensor to obtain the two differing views of the lead;
transmitting the two differing views of the lead to memory;
determining a first lead reference position in a first view;
determining a second lead reference position in a second view; and
converting the first and second lead reference positions into an X, Y, and Z world value by using the locations of a calibration pattern stored in memory.
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124. A ball grid array (BGA) device produced according to a process comprising:
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placing an electronic circuit into a BGA package;
making a three dimensional inspection of a lead on the BGA package; and
selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection;
wherein the three dimensional inspection comprises;
illuminating the lead with a ring light and a side light that are spectrally diverse from one another;
providing fixed optical elements to obtain two differing views of the lead;
disposing a single one sensor to obtain the two differing views of the lead;
transmitting the two differing views of the lead to memory;
determining a first lead reference position in a first view;
determining a second lead reference position in a second view; and
converting the first and second lead reference positions into a world value by using the locations of a calibration pattern stored in memory.
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125. A ball grid array (BGA) device produced according to a process comprising:
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placing an electronic circuit into a BGA package;
making a three dimensional inspection of a lead on the BGA package; and
selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection;
wherein the three dimensional inspection comprises;
illuminating the lead;
providing fixed optical elements to obtain a first view of the lead that comprises a segment having a donut shape and a second view of the lead that comprises a segment having a crescent shape;
disposing a single sensor to obtain the first and second views of the lead;
transmitting the two differing views of the lead to memory;
determining a first lead reference position in a first view;
determining a second lead reference position in a second view; and
converting the first and second lead reference positions into a world value by using the locations of a calibration pattern stored in memory.
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Specification