Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
First Claim
Patent Images
1. A spatial light modulator comprising:
- a lower silicon substrate comprising a plurality of circuitry, electrodes and deflectable mirrors disposed within a rectangular active area on the silicon substrate;
a glass substrate bonded in spaced apart relationship to the lower substrate;
an intermediate substrate bonded between the upper and lower substrates and having an open area for defining a cavity between the silicon substrate and the glass substrate, with the mirrors deflectable within the gap;
wherein the mirrors comprise substantially square mirror plates having edges that are neither perpendicular nor parallel to edges of the rectangular active area, and torsion hinges that allow the mirror plates to move relative to the silicon and glass substrates;
a RAM cell at each mirror location; and
wherein an edge of the silicon substrate is bonded offset from an edge of the glass substrate.
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Abstract
A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.
105 Citations
47 Claims
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1. A spatial light modulator comprising:
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a lower silicon substrate comprising a plurality of circuitry, electrodes and deflectable mirrors disposed within a rectangular active area on the silicon substrate;
a glass substrate bonded in spaced apart relationship to the lower substrate;
an intermediate substrate bonded between the upper and lower substrates and having an open area for defining a cavity between the silicon substrate and the glass substrate, with the mirrors deflectable within the gap;
wherein the mirrors comprise substantially square mirror plates having edges that are neither perpendicular nor parallel to edges of the rectangular active area, and torsion hinges that allow the mirror plates to move relative to the silicon and glass substrates;
a RAM cell at each mirror location; and
wherein an edge of the silicon substrate is bonded offset from an edge of the glass substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47)
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16. The spatial light modulator of claim IS, wherein the torsion hinges having a thickness of 50 Å
- to 2100 Å
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- to 2100 Å
Specification