Method for ion implanting insulator material to reduce dielectric constant
First Claim
1. A material having a reduced dielectric constant, comprising a dielectric layer containing gas bubbles formed by ion implantation of a gaseous species into said layer.
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Accused Products
Abstract
An integrated microelectronic circuit has a multi-layer interconnect structure overlying the transistors consisting of stacked metal pattern layers and insulating layers separating adjacent ones of said metal pattern layers. Each of the insulating layers is a dielectric material with plural gas bubbles distributed within the volume of the dielectric material to reduce the dielectric constant of the material, the gas bubbles being formed by ion implantation of a gaseous species into the dielectric material.
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Citations
54 Claims
- 1. A material having a reduced dielectric constant, comprising a dielectric layer containing gas bubbles formed by ion implantation of a gaseous species into said layer.
- 7. A material comprising an amorphous or polycrystalline or crystalline lattice of one or more atomic species, said lattice being a dielectric material, and plural bubbles distributed within the volume of said lattice and formed by ion implantation of a gaseous species into said lattice.
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14. An integrated circuit comprising a semiconductor substrate and plural films on said semiconductor substrate, at least one of said films being an insulation layer, and plural bubbles distributed within the volume of said lattice and formed by ion implantation of a gaseous species into said lattice.
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15. An integrated microelectronic circuit comprising plural transistors and a multi-layer interconnect structure overlying said transistors and comprising stacked metal pattern layers and insulating layers separating adjacent ones of said metal pattern layers, each of said insulating layers comprising a dielectric material, and plural bubbles distributed within the volume of said dielectric material and formed by ion implantation of a gaseous species into said dielectric material.
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16. A method of forming a low dielectric constant insulating film on a workpiece, comprising:
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forming a dielectric layer on said workpiece; and
ion implanting a gaseous species into said dielectric layer so as to form gas bubbles in said dielectric layer. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 53, 54)
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40. A method of forming a thin film on a semiconductor structure with enhanced adhesion, comprising:
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depositing an overlying dielectric film on an underlying layer of a semiconductor structure; and
performing plasma immersion ion implantation on said semiconductor structure to form a boundary layer at the interface between the dielectric film and the underlying layer containing atoms from both said dielectric layer and said underlying layer.
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41. A method of forming a porous dielectric film of a semiconductor structure with enhanced hardness of the porous dielectric film, comprising:
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depositing an overlying porous dielectric film on an underlying layer of a semiconductor structure; and
performing plasma immersion ion implantation of a gaseous species on said semiconductor structure to fill pores of said porous film with gas.
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42. A method of forming a porous dielectric film on a semiconductor structure having reduced tensile stress, comprising:
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depositing an overlying porous dielectric film on an underlying layer of a semiconductor structure; and
performing plasma immersion ion implantation on said semiconductor structure to break atomic bonds within said porous film.
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43. A method of forming a porous dielectric film on an underlying layer of a semiconductor structure having enhanced adhesion with the underlying layer, reduced tensile stress and enhanced hardness, comprising:
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depositing an overlying porous dielectric film on an underlying layer of a semiconductor structure; and
performing plasma immersion ion implantation on said semiconductor structure of a gaseous species to break atomic bonds within said porous film, to form a boundary layer at the interface between the dielectric film and the underlying layer containing atoms from both said dielectric layer and said underlying layer, and to fill pores of said porous film with gas.
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44. A method of forming a dielectric film on an underlying layer of a semiconductor structure having reduced dielectric constant, reduced tensile stress and enhanced hardness, comprising:
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depositing an overlying dielectric film on an underlying layer of a semiconductor structure, and doping the dielectric film with a first species that reduces the dielectric constant of the dielectric film; and
increasing the hardness of said dielectric film by ion implanting a second species into said dielectric film. - View Dependent Claims (45, 46, 47, 48)
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49. A method of forming a dielectric film on an underlying layer of a semiconductor structure having reduced dielectric constant, reduced tensile stress and enhanced hardness, comprising:
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depositing an overlying dielectric film on an underlying layer of a semiconductor structure; and
decreasing the dielectric constant of said dielectric film by ion implanting a first species into said dielectric film so as to dope said dielectric film with said first species, while simultaneously enhancing the hardness of the doped dielectric film by ion implanting a second species into said dielectric film. - View Dependent Claims (50, 51, 52)
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Specification