Treatment of a dielectric layer using supercritical CO2
First Claim
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1. A method of treating a low-k surface comprising:
- treating a plurality of features in a dielectric material with a passivating solution comprising an amount of a silylating agent comprising organic groups; and
removing the passivating solution, wherein at least one of the plurality of features is at least partially passivated with the organic groups.
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Abstract
A method of passivating silicon-oxide based low-k materials using a supercritical carbon dioxide passivating solution comprising a silylating agent is disclosed. The silylating agent is preferably an organosilicon compound comprising organo-groups with five carbon atoms such as hexamethyldisilazane (HMDS), chlorotrimethylsilane (TMCS), trichloromethylsilane (TCMS) and combinations thereof. In accordance with further embodiments of the invention, a post ash substrate comprising a dielectric material is simultaneously cleaned and passivated using a supercritical carbon dioxide cleaning solution.
136 Citations
36 Claims
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1. A method of treating a low-k surface comprising:
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treating a plurality of features in a dielectric material with a passivating solution comprising an amount of a silylating agent comprising organic groups; and
removing the passivating solution, wherein at least one of the plurality of features is at least partially passivated with the organic groups. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method of treating a dielectric surface, comprising:
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removing post ash residue from the dielectric surface with a supercritical cleaning solution; and
treating the dielectric surface with a passivating agent in the supercritical cleaning solution to form a passivated dielectric surface. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28, 29)
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30. A method of forming a patterned dielectric layer, the method comprising;
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depositing a continuous layer of dielectric material;
forming a photoresist mask over the continuous layer of dielectric material;
patterning the continuous layer of dielectric material through the photoresist mask;
removing the photoresist mask, thereby forming a post-ash residue; and
removing the post-ash residue using a supercritical solution comprising supercritical carbon dioxide and a silicon-based passivating agent. - View Dependent Claims (31, 32, 33, 34, 35, 36)
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Specification