Electrical contacts, devices including the same, and associated methods of fabrication
First Claim
1. A contact for a semiconductor device component, comprising:
- a core comprising a polymer and configured to protrude from the semiconductor device component; and
a conductive coating on at least a portion of the core.
1 Assignment
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Accused Products
Abstract
An electrical contact for use with a semiconductor device, a carrier, a probe card, or another substrate includes a stereolithographically fabricated portion, which may comprise a plurality of at least partially superimposed, contiguous, mutually adhered layers. The electrical contact may include a dielectric core and a conductive coating on at least a portion thereof, or it may be completely formed from conductive material. The electrical contact may be rigid or flexible and resilient. Protective structures for use with flexible resilient contacts prevent deformation of such contacts beyond their elastic limits. Probe cards are also disclosed, as are methods for fabricating the electrical contacts, protective structures, and probe cards.
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Citations
92 Claims
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1. A contact for a semiconductor device component, comprising:
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a core comprising a polymer and configured to protrude from the semiconductor device component; and
a conductive coating on at least a portion of the core. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A method for forming a contact for a semiconductor device component, comprising:
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stereolithographically fabricating a core of the contact; and
coating at least a portion of the core with at least one layer comprising conductive material. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33)
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- 34. A contact of a semiconductor device component, comprising a plurality of at least partially superimposed, contiguous, mutually adhered layers.
- 39. A method for forming a contact for a semiconductor device component, comprising stereolithographically fabricating at least one layer of the contact.
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44. A method for fabricating a probe card, comprising:
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forming a sacrificial layer over a surface of a fabrication substrate;
forming at least one elongate contact over the sacrificial layer;
forming a support plate laterally around an intermediate section of the at least one elongate contact; and
removing the sacrificial layer to facilitate removal of the at least one contact from the fabrication substrate. - View Dependent Claims (45, 46, 47, 48, 49, 50, 51, 52, 53)
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- 54. A method for fabricating a probe card, comprising stereolithographically fabricating at least a portion of at least one of a support plate and a contact of the probe card.
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60. A method for fabricating a probe card, comprising:
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providing a substrate including at least one aperture extending therethrough;
stereolithographically fabricating an outer shell of a contact within the at least one aperture; and
introducing conductive material into a channel extending through the outer shell. - View Dependent Claims (61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73)
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74. A semiconductor device component, comprising:
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a substrate;
at least one flexible, resilient contact protruding from at least one surface of the substrate; and
at least one protective structure positioned on the at least one surface so as to prevent deformation of the at least one flexible, resilient contact beyond an elastic limit thereof. - View Dependent Claims (75, 76, 77, 78, 79, 80, 81, 82)
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83. A method for protecting flexible, resilient contacts that protrude from at least one of surface of a substrate, comprising disposing a protective structure on the at least one surface laterally adjacent to each flexible, resilient contact that protrudes from the at least one surface, the protective structure:
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having a height which at least partially prevents an adjacent flexible, resilient contact from being deformed beyond its elastic limit;
orbeing spaced apart from the adjacent flexible, resilient contact a distance which at least partially prevents the adjacent flexible, resilient contact from being deformed beyond the elastic limit. - View Dependent Claims (84, 85, 86, 87, 88, 89, 90, 91, 92)
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Specification