Hermetically sealed package for optical, electronic, opto-electronic and other devices

• US 20050194677A1
• Filed: 03/03/2004
• Published: 09/08/2005
• Est. Priority Date: 03/03/2004
• Status: Active Grant

• Current Assignee: Epistar Corporation
• Original Assignee: Hymite A/S
• Inventors: Heschel, Matthias, Hoeg, Jorgen, Blidegn, Kristian
• Granted Patent: US 7,109,580 B2
• Time in Patent Office: Days
• US Class Current: 257/704
• CPC Class Codes: B81B 7/0077 Other packages not provided for in groups B81B7/0035 - B81B7/0074
• CPC Class Codes: G02B 26/0833 the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD G02B26/0825 takes precedence; micromechanical devices in general B81B

Abstract

Techniques are disclosed for hermetically sealing one or more devices within a package. According to one aspect, a lid is attached to a substrate on which one or more devices are provided such that the devices are encapsulated within an area defined by the substrate and the lid. A substance, such as a lubricant or gas, is introduced via one or more through-holes in the lid to a region that is separated from the devices by a wall having at least one opening through which the substance can pass to the devices. The through-hole then may be hermetically sealed, for example, using a local heating process that does not degrade the lubricant or other substance.

Claims

1. A method of hermetically sealing one or more devices within a package, the method comprising:

attaching a lid to a substrate on which the one or more devices are provided such that the one or more devices are encapsulated within an area defined by the substrate and the lid;

introducing a substance via a through-hole in the lid to a region that is separated from the one or more devices by a wall having an opening through which the substance can pass to the one or more devices; and

hermetically sealing the through-hole.

2. The method of claim 1 wherein attaching the lid to the substrate includes soldering the lid to the substrate to form a hermetic seal.

3. The method of claim 1 wherein the substance comprises a lubricant.

4. The method of claim 3 wherein at least some of the lubricant evaporates and passes through the opening to the one or more devices.

5. The method of claim 1 wherein the substance comprises a fluid.

6. The method of claim 1 including providing one or more semiconductor devices on the substrate.

7. The method of claim 1 including providing one or more MEMS devices on the substrate.

8. The method of claim 1 including providing an array of devices on the substrate.

9. The method of claim 1 including performing a dicing process to separate the package from other similarly formed packages after hermetically sealing the through-hole.

10. The method of claim 1 including passing a signal between the exterior of the package and the one or more devices via an electrical contact extending through the substrate.

11. The method of claim 1 including passing an optical signal through the lid to or from the one or more devices.

12. The method of claim 1 wherein hermetically sealing the through-hole includes using a local heating process that does not degrade the substance.

13. The method of claim 1 wherein hermetically sealing the through-hole includes using a jet-soldering technique.

14. A hermetically sealed package comprising:

one or more devices on a substrate;

a lid attached to the substrate to encapsulate the one or more devices such that the one or more devices are hermetically sealed within an area defined by the substrate and the lid;

wherein the lid includes;

a region containing a substance;

a wall separating the region containing the substance from the one or more devices, wherein the wall has an opening through which the substance can pass to the one or more devices.

15. The package of claim 14 wherein the lid includes a material that provides a seal for a hole in the lid through which the substance was introduced into the package.

16. The package of claim 14 wherein the lid includes a material that hermetically seals a hole in the lid through which the substance was introduced into the package.

17. The package of claim 14 wherein the substrate includes an electrical contact from the exterior of the package to the one or more devices encapsulated within the package.

18. The package of claim 14 wherein the substance comprises a lubricant.

19. The package of claim 14 wherein the substance comprises a lubricant to reduce wear of the one or more devices.

20. The package of claim 14 wherein the substance comprises a fluid.

21. The package of claim 14 wherein the one or more devices include semiconductor devices.

22. The package of claim 14 wherein the one or more devices comprise an array of devices.

23. The package of claim 14 wherein the one or more devices comprise at least one MEMS device.

24. The package of claim 14 wherein the lid is transparent to optical signals with which the one or more devices interact during their operation.

25. The package of claim 14 wherein the substrate is attached to the lid by a solder seal ring.