Midspan patch panel with compensation circuit for data terminal equipment, power insertion and data collection

• US 20050195584A1
• Filed: 03/03/2004
• Published: 09/08/2005
• Est. Priority Date: 03/03/2004
• Status: Active Grant

• Current Assignee: Hubbell, Inc.
• Original Assignee: Hubbell, Inc.
• Inventors: AbuGhazaleh, Shadi A., Miller, Alan C., Baxter, Robert C., O'Connor, Michael R., Mahmood, Rehan
• Granted Patent: US 7,038,918 B2
• Time in Patent Office: Days
• US Class Current: 361/780
• CPC Class Codes: H04Q 1/13 Patch panels for monitoring, interconnecting or testing circuits, e.g. patch bay, patch field or jack field; Patching modules
• CPC Class Codes: H05K 1/0228 Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors balanced signal pairs H05K1/0245
• CPC Class Codes: H05K 1/0231 Capacitors or dielectric substances
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 2201/09236 Parallel layout layout of balanced signal pairs H05K1/0245; superposed layout H05K2201/09672
• CPC Class Codes: H05K 2201/10189 Non-printed connector
• CPC Class Codes: Y10S 439/941 Crosstalk suppression

Abstract

A compensating advanced feature patch panel that can include removable modular or fixed electronic components located directly on the patch panel which are separately or in combination capable of providing advanced features such as device detection and power insertion. The patch panel provides communications between an insulation displacement connector (IDC) at a PD/User end, and any standard interface type using unshielded twisted pair cables, such as an RJ45 connector at a switch end at performance levels of at least category 3, 5, 5e, 6 and/or higher (e.g. 6e or 7) and equivalent performance levels as required by compensating for the active electronics used in providing advanced features through the use of inductive, capacitive and reactive circuit elements to compensate for advanced feature electronics.

Claims

1. A compensating advanced feature patch panel that can include removable modular or fixed electronic components, wherein the patch panel provides improved performance levels, said patch panel comprising:

a multilayered patch panel printed circuit board comprising a plurality of layers;

a communication circuit disposed on at least a first layer of said plurality and electrically coupled between an insulation displacement connector (IDC) at a PD/User end and an RJ45 connector at a telecommunication equipment end;

at least one of a removable modular or fixed electronic component electrically (coupled with said communication circuit, said component comprised of at least one active circuit disposed on at least a second layer of said plurality to provide an advanced feature; and

a plurality of compensating circuit elements disposed upon at least one layer of said plurality to establish a compensating capacitance and inductive coupling with said active circuit to substantially minimize at least one adverse effect resulting from said active circuit and thereby providing improved performance levels.

2. A compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 1, wherein said communication circuit includes at least one of a signal carrying trace or a telecommunication routing circuit.

3. A compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 1, wherein said advanced feature includes at least one of a device detection feature, logical operation feature and power insertion feature.

4. A compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 1, wherein said active circuit includes at least one of an active circuit secondary routing layer, active circuit component, IDC component, plug-in module connector and primary routing for active circuitry.

5. A compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 4, wherein said active circuit component includes at least one DC blocking capacitor.

6. A compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 4, wherein said active circuit component includes at least one center-tapped transformer.

7. A compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 4, wherein said active circuit component includes at least one operational amplifier.

8. A compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 1, wherein said plurality of compensating circuit elements disposed upon said at least one layer includes at least one of an inductive, capacitive and reactive element to establish said compensating coupling with said active circuit.

9. A compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 8, wherein said inductive, capacitive and reactive element is comprised of a signal carrying trace.

10. A compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 8, wherein said inductive, capacitive and reactive element is comprised of a conductive foil capacitor circuit.

11. A compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 1, wherein said adverse effect includes at least one of an increased noise level, reflection, adverse inductive coupling and adverse capacitive coupling.

12. A compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 1, wherein said improved performance levels include at least one of a category 3, 5, 5e, 6, 6e and 7 performance levels and higher.

13. A compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 1, wherein said multilayered patch panel printed circuit board further comprises a 3 U panel size having at least 48 ports.

14. A compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 1, wherein said multilayered patch panel printed circuit board further consists of a panel having at least 48 ports and at least one of a height dimension of 1 U, 2 U and 3 U.

15. A compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 1, wherein said multilayered patch panel printed circuit board further comprises a cable management mechanism.

16. A compensating advanced feature patch panel that can include removable modular or fixed electronic components as claimed in claim 1, wherein said multilayered patch panel printed circuit board further comprises said active circuit and cable management mechanism arranged adjacent to and between said communication circuit upon a surface of said patch panel printed circuit board.

17. A method of making an advanced feature patch panel that can include removable modular or fixed electronic components which are separately or in combination capable of providing advanced features such as device detection and power insertion, wherein the patch panel provides improved performance levels, said method comprising the steps of:

assembling a multilayered patch panel printed circuit board having a plurality of layers;

disposing upon at least a first layer of said plurality a communication circuit, said communication circuit electrically coupled between an insulation displacement connector (IDC) at a PD/User end and an RJ45 connector at a telecommunication equipment end;

disposing upon at least a second layer of said plurality at least one of a removable modular and fixed electronic component electrically coupled with said communication circuit, said component comprised of at least one active circuit for use in providing an advanced feature; and

disposing upon at least one layer of said plurality a compensating circuit element to establish a compensating capacitance and inductive coupling with said active circuit to substantially minimize at least one adverse effect resulting from said active circuit and thereby providing improved performance levels.

18. A method of making an advanced feature patch panel as claimed in claim 17, further comprising the step of disposing upon said first layer of said plurality a communication circuit including at least one of a signal carrying trace or a telecommunication routing circuit.

19. A method of making an advanced feature patch panel as claimed in claim 17, further comprising the step of disposing upon said second layer of said plurality at least one of a removable modular or fixed electronic component including at least one of an active circuit secondary routing layer, active circuit component, IDC component, plug-in module connector and primary routing for active circuitry.

20. A method of making an advanced feature patch panel as claimed in claim 19, wherein said active circuit component includes at least one DC blocking capacitor.

21. A method of making an advanced feature patch panel as claimed in claim 19, wherein said active circuit component includes at least one center-tapped transformer.

22. A method of making an advanced feature patch panel as claimed in claim 19, wherein said active circuit component includes at least one operational amplifier.

23. A method of making an advanced feature patch panel as claimed in claim 17, wherein said compensating circuit element disposed upon said at least one layer includes at least one of an inductive, capacitive and reactive element to establish said compensating coupling with said active circuit.

24. A method of making an advanced feature patch panel as claimed in claim 17, wherein said adverse effect includes at least one of an increased noise level, reflection, adverse inductive coupling and adverse capacitive coupling.

25. A method of making an advanced feature patch panel as claimed in claim 17, wherein said improved performance levels include at least one of a category 3, 5, 5e, 6, 6e and 7 performance level and higher.