System capable of determining applied and anodized coating thickness of a coated-anodized product

• US 20050196522A1
• Filed: 01/07/2005
• Published: 09/08/2005
• Est. Priority Date: 12/21/2000
• Status: Active Grant

• Current Assignee: Sensory Analytics, LLC
• Original Assignee: Sensory Analytics, LLC
• Inventors: Price, Joseph K.
• Granted Patent: US 7,365,860 B2
• Time in Patent Office: Days
• US Class Current: 427/8
• CPC Class Codes: C25D 11/005 Apparatus specially adapted for electrolytic conversion coating apparatus in general for electrolytic coating C25D17/00
• CPC Class Codes: C25D 11/022 Anodisation on selected surface areas
• CPC Class Codes: C25D 21/12 Process control or regulation controlling or regulating in general G05
• CPC Class Codes: G01B 11/0675 using interferometry
• CPC Class Codes: G01B 11/0683 measurement during deposition or removal of the layer
• CPC Class Codes: G01N 21/3563 for analysing solids; Preparation of samples therefor
• CPC Class Codes: G01N 21/8422 Investigating thin films, e.g. matrix isolation method

Abstract

A system for forming an anodized coating on at least a portion of a substrate thereby creating an anodized substrate is disclosed. The system includes a bath, a coating thickness monitor, at least one probe and at least one controller. The coating thickness monitor includes at least one radiation source directed at at least a portion of the anodized substrate; at least one probe for capturing at least a portion of the radiation reflected and refracted by the anodized coating on the anodized substrate, the captured radiation being at least a portion of the radiation directed the anodized substrate from the radiation source; and at least one detector in communication with the at least one probe, the at least one detector capable of processing the captured radiation to allow a determination of at least the thickness.

Claims

1. An system for forming a coated-anodized coating on at least a portion of a substrate thereby creating an coated-anodized substrate, said system including:

(a) a bath into which the substrate is placed to facilitate the formation of the anodized coating on at least a portion of on the substrate thereby creating the anodized substrate;

(b) an applicator to facilitate the formation of the coating on at least a portion of the anodized substrate thereby creating the coated-anodized substrate; and

(c) a coating thickness monitor capable of measuring the thickness of at least a portion of the coated-anodized coating on the substrate, said coating thickness monitor including;

(i) at least one radiation source directed at at least a portion of the anodized substrate,

(ii) at least one probe for capturing at least a portion of the radiation reflected and refracted by the anodized coating on the anodized substrate, the captured radiation being at least a portion of the radiation directed the anodized substrate from said radiation source, and

(iii) at least one detector in communication with said at least one probe, said at least one detector capable of processing the captured radiation to allow a determination of at least the thickness of the anodized coating on the substrate.

2. The system of claim 1 further including at least one controller in communication with said coating thickness monitor.

3. The system according to claim 2 wherein said at least one controller regulates a relative movement of said probe and the anodized substrate or said probe and the coated-anodized substrate.

4. The system according to claim 2 wherein said at least one controller regulates a process endpoint.

5. A coating thickness monitor for measuring the thickness of at least a portion of an coated-anodized coating on at least a portion of a substrate, said coating thickness monitor including:

(a) at least one radiation source directed at at least a portion of the anodized substrate;

(b) at least one probe for capturing at least a portion of the radiation reflected and refracted by the anodized coating on the anodized substrate, the captured radiation being at least a portion of the radiation directed the anodized substrate from said radiation source;

(c) at least one detector in communication with said at least one probe, said at least one detector capable of processing the captured radiation to allow a determination of at least the thickness of the anodized coating on the substrate; and

(d) a guide system capable of transmitting the captured radiation from said at least one probe to said at least one detector.

6. The coating thickness monitor according to claim 5 wherein said guide system is an optical guide.

7. The coating thickness monitor according to claim 6 wherein said optical guide is an optical fiber.

8. The coating thickness monitor according to claim 5 wherein said processing of the captured radiation to determine the coating thickness by said coating thickness monitor includes at least one of using a color, using an interference pattern, using an amount of absorbed radiation, using an intensities ratio of a minimum reflected radiation wavelength and a maximum reflected radiation wavelength, and using a Fast Fourier Transformation (FFT) of the captured radiation.

9. The coating thickness monitor according to claim 5 wherein said processing of the captured radiation to determine the coating thickness by said coating thickness monitor includes using a Fast Fourier Transformation (FFT) of the captured radiation.

10. A method for measuring coating thickness of at least a portion of a coated-anodized coating on at least a portion of a substrate, said method including:

(a) providing coating thickness monitor;

(b) directing at least one radiation source at at least a portion of the coated-anodized substrate;

(c) capturing using at least one probe, at least a portion of the radiation reflected and refracted by the coated-anodized coating on the substrate, the captured radiation being at least a portion of the radiation directed the coated-anodized substrate from said radiation source;

(d) transmitting the captured radiation using a guide system from said at least one probe to said at least one detector; and

(e) processing the captured radiation to allow a determination of at least the thickness of the anodized coating on the substrate.

11. A method according to claim 10 for measuring coating thickness of at least a portion of a coated-anodized coating wherein said coated-anodized coating comprises a barrier coating.

12. A method according to claim 11 for measuring coating thickness of at least a portion of a coated-anodized coating wherein said barrier coating comprises an organic coating.

13. A method according to claim 12 for measuring coating thickness of at least a portion of a coated-anodized coating wherein said organic coating comprises one of an epoxy and a polyurethane.

14. A method according to claim 13 for measuring coating thickness of at least a portion of a coated-anodized coating wherein said epoxy coating comprises one of an epoxy polyamine and a epoxy polyamide primer.

15. A method according to claim 12 for measuring coating thickness of at least a portion of a coated-anodized coating wherein said organic coating comprises a resin.

16. A method according to claim 12 for measuring coating thickness of at least a portion of a coated-anodized coating wherein said organic coating comprises a composite coating.

17. A method according to claim 12 for measuring coating thickness of at least a portion of a coated-anodized coating wherein said organic coating comprises a top coat.