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Heat sink for an electronic power component

  • US 20050199373A1
  • Filed: 03/09/2005
  • Published: 09/15/2005
  • Est. Priority Date: 03/12/2004
  • Status: Abandoned Application
First Claim
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1. A heat sink (10) comprising a body (12) made of a metallic material having a surface intended to support an electronic power component (14), the body comprising a plurality of openings (22) axially crossed by tubes (24) of circulation of a cooling liquid, each tube being formed of a material with a good thermal conductivity and being separated from the body by a ring-shaped electric isolation layer formed of a compressed powder of at least one material with good electric isolation and thermal conduction properties.

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