Heat dissipation module with heat pipes

• US 20050199377A1
• Filed: 02/08/2005
• Published: 09/15/2005
• Est. Priority Date: 03/11/2004
• Status: Abandoned Application

• Current Assignee: Quanta Computer
• Original Assignee: Quanta Computer
• Inventors: Chan, Hung-Chou, Chuang, Chi-Hung, Hwang, Wen-Liang, Chen, Chao-Jung
• Application Number:
  US11/053,616
• Publication Number:
  US 20050199377A1
• Time in Patent Office: Days
• US Class Current: 165/104.33
• CPC Class Codes: F28D 15/02 in which the medium condenses and evaporates, e.g. heat pipes heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257
• CPC Class Codes: F28F 1/32 the means having portions engaging further tubular elements
• CPC Class Codes: F28F 2275/04 by brazing
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat dissipation module including heat pipes. The heat dissipation module includes a seat with grooves, heat pipes and two fin assemblies. The heat pipes are secured in the grooves at a first end and extend at the second end thereof. A first fin assembly with parallel first fins is soldered to the seat, covering the grooves and heat pipes. A second fin assembly with parallel second fins is secured to the cantilevered end of the heat pipes.

Claims

1. A heat dissipation module comprising:

a seat with a plurality of grooves, contacting a heat source;

a first fin assembly with a plurality of first fins disposed on the seat, covering the grooves;

a second fin assembly with a plurality of second fins disposed on a side of the first fin assembly; and

a plurality of heat pipes, each heat pipe comprising a first end disposed in the grooves, covered by the first fin assembly, and a second end extending from the grooves and passing through the second fin assembly.

2. The heat dissipation module as claimed in claim 1, wherein the first fins are parallel.

3. The heat dissipation module as claimed in claim 1, wherein the second first fins are parallel.

4. The heat dissipation module as claimed in claim 1, wherein the first fins are perpendicular to the heat pipes.

5. The heat dissipation module as claimed in claim 1, wherein the second fins are perpendicular to the heat pipes.

6. The heat dissipation module as claimed in claim 1, wherein the heat pipes are soldered in the grooves.

7. The heat dissipation module 10 as claimed in claim 1, wherein the first fin assembly is soldered on the seat.

8. The heat dissipation module as claimed in claim 1, wherein the second fin assembly is soldered to the second ends of the heat pipes.

9. The heat dissipation module as claimed in claim 1, wherein the seat, the heat pipes, the first fin assembly and the second fin assembly comprise copper or aluminum.

10. A heat dissipation module comprising:

a seat;

a plurality of heat pipes disposed on the seat and extending from the seat, forming a plurality of cantilevered ends;

a first fin assembly with a plurality of first fins, disposed on the seat and covering the heat pipes; and

a second fin assembly with a plurality of second fins, secured at the cantilevered ends of the heat pipes.

11. The heat dissipation module as claimed in claim 10, wherein the first fins are parallel.

12. The heat dissipation module as claimed in claim 10, wherein the second first fins are parallel.

13. The heat dissipation module as claimed in claim 10, wherein the first fins are perpendicular to the heat pipes.

14. The heat dissipation module as claimed in claim 10, wherein the second fins are perpendicular to the heat pipes.

15. The heat dissipation module as claimed in claim 10, wherein the heat pipes are soldered on the seat.

16. The heat dissipation module as claimed in claim 10, wherein the first fin assembly is soldered on the seat.

17. The heat dissipation module as claimed in claim 10, wherein the second fin assembly is soldered to the cantilevered ends of the heat pipes.

18. The heat dissipation module as claimed in claim 10, wherein the seat, the heat pipes, the first fin assembly and the second fin assembly comprise copper or aluminum.