Optical sensor

• US 20050199792A1
• Filed: 03/11/2005
• Published: 09/15/2005
• Est. Priority Date: 03/11/2004
• Status: Active Grant

• Current Assignee: Leuze electronic GmbH & Co. KG
• Original Assignee: Leuze electronic GmbH & Co. KG
• Inventors: Mast, Gernot, Dummel, Thomas, Argast, Martin, Schwartz, Gunther
• Granted Patent: US 7,476,848 B2
• Time in Patent Office: Days
• US Class Current: 250/239
• CPC Class Codes: G01B 11/026 by measuring distance between sensor and object G01B11/0608 takes precedence
• CPC Class Codes: G01D 11/245 Housings for sensors
• CPC Class Codes: G01D 5/26 characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
• CPC Class Codes: H03K 17/941 using an optical detector H03K17/968 takes precedence
• CPC Class Codes: H03K 2017/9455 constructional details
• CPC Class Codes: H03K 2217/94108 making use of reflection

Abstract

An optical sensor for detecting objects within an area to be monitored comprises at least one casing to accommodate optical and electronic components. The at least one casing comprises casing parts. The casing parts are composed of a low-pressure injection molding compound and are formed by a low-pressure injection molding operation.

Claims

1. An optical sensor for detecting objects within an area to be monitored, said sensor comprising:

at least one casing to accommodate optical and electronic components, the at least one casing comprising casing parts, wherein the casing parts comprise a low-pressure injection molding compound and are formed by a low-pressure injection molding operation.

2. The optical sensor according to claim 1, wherein the low-pressure injection molding compound comprises polyamide.

3. The optical sensor according to claim 1, wherein one of said casing parts comprises a casing body comprised of the low-pressure injection molding compound.

4. The optical sensor according to claim 3, wherein the optical and electronic components of this sensor form an assembly unit that is encased during the low-pressure injection molding operation with low-pressure injection molding compound to form the casing body.

5. The optical sensor according to claim 1, wherein at least one of a position fixation means or a sealing means is produced from the low-pressure injection molding compound during a low-pressure injection molding operation.

6. The optical sensor according to claim 5, wherein the casing comprises:

a casing body to accommodate the optical and electronic components; and

a lid to close off the casing body,

wherein the lid is secured to the casing body by parts comprising low-pressure injection molding compound, and wherein joints between the casing body and the lid are sealed by parts comprising low-pressure injection molding compound.

7. The optical sensor according to claim 6, wherein a closed low-pressure injection molding channel is formed along the joining locations between the casing body and the lid when the lid is fitted onto the casing body, and wherein this channel is filled with low-pressure injection molding compound during an injection molding operation.

8. The optical sensor according to claim 5, the sensor further comprising:

electrical connecting means comprising a low-pressure injection molding compound and secured in position on the casing.

9. The optical sensor according to claim 8, wherein parts made from low-pressure injection molding compound function as the sealing means.

10. The optical sensor according to claim 8, wherein the electrical connecting means project into a low-pressure injection molding channel.

11. The optical sensor according to claim 8, wherein the electrical connecting means comprises a connector.

12. The optical sensor according to claim 11, wherein the connector comprises a low-pressure injection molding compound.

13. The optical sensor according to claim 8, wherein the electrical connecting means comprises a cable.

14. The optical sensor according to claim 13, further comprising:

an anti-kinking sleeve comprising low-pressure injection molding compound, the cable being positioned within the anti-kinking sleeve, the anti-kinking sleeve being adapted to provide pull relief for the cable.

15. The optical sensor according to claim 14, wherein the anti-kinking sleeve adjoins the low-pressure injection molding channel.

16. The optical sensor according to claim 1, the sensor further comprising:

light-guiding parts comprising low-pressure injection molding compound.

17. The optical sensor according to claim 16, the sensor further comprising:

a light-emitting, status indicating element; and

a light guiding element comprising low-pressure injection molding compound to guide light from the light-emitting, status indicating element to a light exit surface on the outside of casing.

18. The optical sensor according to claim 17, the sensor further comprising:

a low-pressure injection molding channel filled with a low-pressure injection molding compound, wherein the low-pressure injection molding channel filled with the low-pressure injection molding compound forms the light guiding element.

19. The optical sensor according to claim 1, wherein the sensor further comprises:

a transmitter to emit light rays;

a receiver to receive light rays; and

at least one exit window in the casing,

wherein transmitted light rays and receiving light rays are guided through the at least one exit window.

20. The optical sensor according to claim 19, the sensor further comprising:

a frame comprised of low-pressure injection molding compound,

wherein the at least one exit window is to be positioned inside the frame.

21. The optical sensor according to claim 20, wherein the frame is injection molded onto the outside of the casing by a low-pressure injection molding operation.