Electronic device

• US 20050201069A1
• Filed: 03/08/2005
• Published: 09/15/2005
• Est. Priority Date: 03/15/2004
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Kirigaya, Masato
• Granted Patent: US 7,375,974 B2
• Time in Patent Office: Days
• US Class Current: 361/752
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/15322 being a pin array, e.g. PGA
• CPC Class Codes: H01L 2924/16251 Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
• CPC Class Codes: H01L 2924/19106 in a mirrored arrangement on two different side of a common die mounting substrate
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 2201/09745 Recess in conductor, e.g. in pad or in metallic substrate
• CPC Class Codes: H05K 2201/1056 Metal over component, i.e. metal plate over component mounted on or embedded in PCB
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 7/20436 Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
• CPC Class Codes: H05K 7/20854 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20863 takes precedence

Abstract

A circuit board is disposed on a support plate, with electronic components mounted on this circuit board being accommodated in recessed portions of the support plate. Thermal adhesive members intervene between rear surfaces of the electronic components and bottom surfaces of the recessed portions of the support plate. The support plate has degassing grooves. Furthermore, the support plate has raised portions provided on its upper surface for supporting the circuit board in a floated condition with a gap between them.

Claims

1. An electronic device comprising:

a circuit board disposed on a support plate, with at least one electronic component mounted on said circuit board being accommodated in a recessed portion of said support plate, and

a thermal adhesive member intervening between a rear surface of said electronic component and a bottom surface of the recessed portion of said support plate,

wherein said support plate has a communicating passage having one end opened to an inner space of said recessed portion and the other end opened to an outside of a layout region of said circuit board.

2. The electronic device in accordance with claim 1, wherein said communicating passage is a groove formed on a surface of said support plate opposing to said circuit board.

8. The electronic device in accordance with claim 1, wherein said support plate has a region bonded to said circuit board with resin-based adhesive interposed therebetween, and said other end of said communicating passage is opened to an outside of said region of the support plate bonded to said circuit board.

3. An electronic device comprising:

a circuit board disposed on a support plate, with at least one electronic component mounted on said circuit board being accommodated in a recessed portion of said support plate, and

a thermal adhesive member intervening between a rear surface of said electronic component and a bottom surface of the recessed portion of said support plate,

wherein said support plate has raised portions on its surface opposing to said circuit board for supporting said circuit board in a floated condition with a gap corresponding to the height of said raised portions between said support plate and said circuit board.

4. The electronic device in accordance with claim 3, wherein said raised portions have a pyramid shape.

5. An electronic device comprising:

a circuit board disposed on a support plate, with at least one electronic component mounted on said circuit board being accommodated in a recessed portion of said support plate, and

a thermal adhesive member intervening between a rear surface of said electronic component and a bottom surface of the recessed portion of said support plate,

wherein said support plate has a communicating passage having one end opened to an inner space of said recessed portion and the other end opened to an outside of a layout region of said circuit board, and

said support plate has raised portions on its surface opposing to said circuit board for supporting said circuit board in a floated condition with a gap corresponding to the height of said raised portions between said support plate and said circuit board.

6. The electronic device in accordance with claim 5, wherein said communicating passage is a groove formed on a surface of said support plate opposing to said circuit board.

7. The electronic device in accordance with claim 5, wherein said raised portions have a pyramid shape.