High density front access device
First Claim
1. A high density device comprising:
- a chassis frame configured and dimensioned for mounting in a standardized telecommunications rack;
a sub-module chassis secured to said chassis frame, said sub-module chassis exhibiting a proximal face and a distal face;
a first plurality of jacks located distal of said proximal face of said sub-module chassis; and
a passageway formed between said sub-module chassis and an inner wall of said chassis frame, said passageway configured and dimensioned for the passage of cabling for connection to said first plurality of jacks.
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Accused Products
Abstract
A high density device comprising: a chassis frame configured and dimensioned for mounting in a standardized telecommunications rack, the chassis frame defining a front plane and a back plane, the front plane being substantially coincident with a front support of the telecommunications rack; a sub-module chassis secured to the chassis frame, the sub-module chassis exhibiting a proximal face and a distal face; a first plurality of jacks located distal of the proximal face of the sub-module chassis; and a passageway formed between the sub-module chassis and an inner wall of the chassis frame, the passageway configured and dimensioned for the passage of cabling for connection to the first plurality of jacks.
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Citations
26 Claims
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1. A high density device comprising:
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a chassis frame configured and dimensioned for mounting in a standardized telecommunications rack;
a sub-module chassis secured to said chassis frame, said sub-module chassis exhibiting a proximal face and a distal face;
a first plurality of jacks located distal of said proximal face of said sub-module chassis; and
a passageway formed between said sub-module chassis and an inner wall of said chassis frame, said passageway configured and dimensioned for the passage of cabling for connection to said first plurality of jacks. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. An apparatus for connecting a plurality of cables, the apparatus comprising:
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a chassis frame configured and dimensioned for mounting in a standardized telecommunications rack, said chassis frame exhibiting a front and a back;
a sub-module chassis connected to said chassis frame, said sub-module chassis exhibiting a proximal face and a distal face, said proximal face of said sub-module chassis exhibiting unobstructed access from said chassis frame front;
a first plurality of jacks secured to said sub-module chassis frame and exhibiting unobstructed access from said chassis frame front; and
a second plurality of jacks located distal of said proximal face of said sub-module chassis and proximal of said back of said chassis frame. - View Dependent Claims (23, 24)
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25. An apparatus for connecting a plurality of cables, the apparatus comprising:
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a chassis frame configured and dimensioned for mounting in a standardized telecommunications rack, said chassis frame defining a front and a back;
a sub-module chassis connected to said chassis frame, said sub-module chassis exhibiting a front and a back;
a first plurality of jacks secured to said sub-module chassis, said first plurality of jacks facing said back of said chassis frame;
a second plurality of jacks secured to said sub-module chassis, said second plurality of jacks facing said front of said chassis frame; and
a passageway formed between said sub-module chassis and said chassis frame, said passageway being configured and dimensioned for the passage of at least one cable connected to said first plurality of jacks.
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26. A midspan power insertion module comprising:
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a chassis frame configured and dimensioned for mounting in a standardized telecommunications rack;
a sub-module chassis secured to said chassis frame, said sub-module chassis exhibiting a proximal face and a distal face;
a first plurality of jacks supporting at least 40 ports located distal of said proximal face of said sub-module chassis;
a second plurality of jacks supporting at least 40 ports appearing on said proximal face of said sub-module chassis; and
a passageway formed between said sub-module chassis and an inner wall of said chassis frame, said passageway configured and dimensioned for the passage of cabling for connection to said first plurality of jacks.
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Specification