Expanding thermal plasma deposition system
First Claim
1. A process for coating a substrate comprising:
- generating a plasma from two or more ETP sources, each ETP source including an anode; and
injecting vaporized reagents into the plasma to form the coating on the substrate, the injection of the reagents being located within a specified distance from the anode orifice of the ETP source to obtain one or more uniform coating properties over the substrate.
3 Assignments
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Accused Products
Abstract
A system to coat a substrate includes a deposition chamber maintained at sub-atmospheric pressure, one or more arrays containing two or more expanding thermal plasma sources associated with the deposition chamber, and at least one injector containing orifices for each array. The substrate is positioned in the deposition chamber and each expanding thermal plasma source produces a plasma jet with a central axis, while the injector injects vaporized reagents into the plasma to form a coating that is deposited on the substrate. The injector orifices are located within a specified distance from the expanding thermal plasma source to obtain generally a coating with generally uniform coating properties.
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Citations
31 Claims
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1. A process for coating a substrate comprising:
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generating a plasma from two or more ETP sources, each ETP source including an anode; and
injecting vaporized reagents into the plasma to form the coating on the substrate, the injection of the reagents being located within a specified distance from the anode orifice of the ETP source to obtain one or more uniform coating properties over the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A system for coating large area substrates with generally uniform properties comprising:
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a deposition chamber in which a substrate is positioned, the chamber being maintained at subatmospheric pressure;
two or more ETP sources associated with the deposition chamber, each ETP source including an anode, the ETP source producing a plasma jet having a central axis; and
at least one injector that injects vaporized reagents into the plasma to form a coating that is deposited on the substrate, the injection of the reagents being located within a specified distance from the anode of the ETP source. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31)
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Specification