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Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates

  • US 20050202667A1
  • Filed: 01/03/2005
  • Published: 09/15/2005
  • Est. Priority Date: 12/03/2001
  • Status: Abandoned Application
First Claim
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1. A fabrication process for forming a multi-layer three-dimensional structure that comprises at least one conductive structural material and at least one dielectric material, comprising:

  • (a) forming and adhering a layer of material to a previously formed layer and/or to a substrate, wherein the layer comprises a desired pattern of at least one structural material, a grid pattern of a dielectric material, and a gird pattern of a conductive sacrificial material; and

    (b) repeating the forming and adhering operation of (a) a plurality of times to build up the three-dimensional structure from a plurality of adhered layers.

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