Three-dimentional components prepared by thick film technology and method of producing thereof

• US 20050204939A1
• Filed: 06/02/2003
• Published: 09/22/2005
• Est. Priority Date: 06/03/2002
• Status: Abandoned Application

• Current Assignee: Ing. Ilia Krejci - Engineering
• Original Assignee: Ing. Ilia Krejci - Engineering
• Inventors: Krejci, Jan
• Application Number:
  US10/516,161
• Publication Number:
  US 20050204939A1
• Time in Patent Office: Days
• US Class Current: 101/129
• CPC Class Codes: B01D 61/18 Apparatus therefor
• CPC Class Codes: B01D 61/28 Apparatus therefor
• CPC Class Codes: B01D 63/081 Manufacturing thereof
• CPC Class Codes: B01D 63/088 Microfluidic devices comprising semi-permeable flat membranes
• CPC Class Codes: B01L 2300/0645 Electrodes
• CPC Class Codes: B01L 2300/0681 Filter
• CPC Class Codes: B01L 2300/0816 Cards, e.g. flat sample carriers usually with flow in two horizontal directions
• CPC Class Codes: B01L 2300/0874 Three dimensional network
• CPC Class Codes: B01L 2300/0887 Laminated structure
• CPC Class Codes: B01L 2400/0418 electro-osmotic flow [EOF]
• CPC Class Codes: B01L 2400/0421 electrophoretic flow
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 2203/0127 Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
• CPC Class Codes: B81C 1/0046 using stamping, e.g. imprinting nanoimprinting for making etch masks G03F7/0002
• CPC Class Codes: B81C 2201/019 Bonding or gluing multiple substrate layers
• CPC Class Codes: F04B 43/043 Micropumps
• CPC Class Codes: G01F 1/6845 Micromachined devices
• CPC Class Codes: G01N 27/4473 by electric means
• CPC Class Codes: G01N 27/44791 Microapparatus sample containers with integrated microfluidic structures B01L3/5027

Abstract

Object of the present invention are components with three dimensional structure prepared by thick film technology by print, where between the printed layers is inserted at least one membrane. The membrane is according to the present to invention at least in a part of the final product. The membrane can be provided with holes which are necessary for next technological steps. The inserted membranes can have pores of the size of 50˜tm to 10 nm and a thickness of 1 to 200˜tm. Method of producing of components with three-dimensional structure by thick film printing technology according to the invention lies in that between some of the printed layers is inserted a suitable membrane, which allows to lay on next layers without influence to previous layers. The printing can be done by screen-printing.

Claims

1. Components with three-dimensional structure, prepared by thick film printing technology, characterized in that between the printed layers is inserted at least one membrane.

2. Components with three-dimensional structure, prepared by thick film printing technology, according to claim 1, characterized in that the membrane is present at least in a part of the final product.

3. Components with three-dimensional structure, prepared by thick film printing technology, according to claim 1, characterized in that the membrane is provided with holes.

4. Components with three-dimensional structure, prepared by thick film printing technology, according to claim 1, characterized in that the membrane is made of a compact non-porous material, which is in the place of membrane contact with printed layer perforated in such a way that the smallest distance between the holes is smaller than the quintuple of the printed layer thickness.

5. Components with three-dimensional structure, prepared by thick film printing technology, according to claim 4, characterized in that the membrane is made of metal.

6. Components with three-dimensional structure, prepared by thick film printing technology, according to claim 1, characterized in that the membrane has pores having the size of from 50 μ

m to 10 nm and a thickness of 1-200 micrometer.

7. Components with three-dimensional structure, prepared by thick film printing technology, according to claim 6, characterized in that the membrane is made of polyethylene terephthalate perforated by neutrons with pore diameters of 5-0.051 μ

m and a thickness of 2-20 μ

m.

8. Components with three-dimensional structure, prepared by thick film printing technology, according to claim 2, characterized in that the membrane is made of a material decomposable by heat.

9. Components with three-dimensional structure, prepared by thick film printed technology, according to claim 8, characterized in that the membrane is made of cellulose acetate with a pore diameter of 1-0.0011 μ

m and a thickness of 0.1-50 μ

m.

10. Method of producing components with three-dimensional structure thick film technology by print, according to claim 1, characterized in that, that between some of the printed layers are inserted membranes.

11. Method of producing components with three-dimensional structure thick film technology by print, according to claim 10, characterized in that the print is carried out by screen printing.

12. Method of producing components with three-dimensional structure thick film technology by print, according to claim 10, characterized in that, there are inserted membranes having a pore size of from 50 μ

m to 10 nm.

13. Method of producing components with three-dimensional structure thick film technology by print, according to claim 11, characterized in that the inserted membrane is made of the same material as the screen printing paste binder.

14. Method of producing components with three-dimensional structure thick film technology by print, according to claim 11, characterized in that the inserted membrane is made of a material decomposable by heat and the membrane is present only in a part of the final product.

15. Method of producing components with three-dimensional structure thick film technology by print, according to claim 11, characterized in that the inserted membrane is made of a chemically decomposable material and the membrane is present only in a part of the final product.

16. Method of producing components with three-dimensional structure thick film technology by print, according to claim 12, characterized in that the inserted membrane is prepared of polyethylene terephthalate perforated by neutrons with pore diameters of 5-0.05 μ

m and thickness of 2-20 μ

m.

17. Method of producing components with three-dimensional structure thick film technology by print, according to claim 14, characterized in that, the inserted membrane is prepared from cellulose acetate with pore diameters of 1-0.001 μ

m and a thickness of 0.1-10 μ

m.

18. Method of producing components with three-dimensional structure thick film technology by print, according to claim 10, characterized in that the inserted membrane is provided with gaps necessary for the further technological steps.

19. Method of producing components with three-dimensional structure thick film technology by print, according to claim 10, characterized in that the inserted membrane is prepared from a compact non-porous material, which is in the contact place of membrane with printed layer perforated in such a way, that the smallest distance between the holes is smaller than quintuple of the printed layer thickness.

20. Method of producing components with three-dimensional structure thick film technology by print, according to claim 10, characterized in that the inserted membrane is made of metal.