Optoelectronic semiconductor component

• US 20050205974A1
• Filed: 08/06/2004
• Published: 09/22/2005
• Est. Priority Date: 03/19/2004
• Status: Active Grant

• Current Assignee: Lite-On Technology Corporation
• Original Assignee: Lite-On Technology Corporation
• Inventors: Su, Shu-Yun, Su, Hung-Yuan, Wu, Chung-Chan
• Granted Patent: US 7,009,285 B2
• Time in Patent Office: Days
• US Class Current: 257/678
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An optoelectronic semiconductor component applies to a surface mount component of an optoelectronic semiconductor. The optoelectronic semiconductor component has one or more semiconductor chip secured on a chip carrier. The chip carrier is a part of a lead frame, and another part of the lead frame is formed with an independent connection part as a contact of the semiconductor chip. An encapsulation body centers on the semiconductor chip and encircles part of the chip carrier and the independent connection part to form an annular ellipsoid for reflecting or receiving radiation of the semiconductor chip. The encapsulation body has a recess and a window part filling the recess. The window part is composed of materials for transforming the optical characteristics of the semiconductor chip. Part of the chip carrier and the independent connection part extend out the encapsulation body to form outside contacts as a SMT component.

Claims

1. An optoelectronic semiconductor component, comprising:

a lead frame having a chip carrier, and an independent link-part, said chip carrier formed with a central position mark thereon and defined as an inner electrical contact, said independent link-part being another inner electrical contact;

a semiconductor chip secured on said chip carrier, said semiconductor chip electrically connected with said chip carrier and said independent link-part;

an encapsulation body formed with an axial-symmetrical arc section centered on said semiconductor chip, an inner surface of said encapsulation body encircling a part of said chip carrier and said independent link-part to define an annular ellipsoid;

an optical window part formed in a concave portion of said annular ellipsoid; and

a pair of outside connecting parts respectively extending from said chip carrier and said independent link-part and exposed by said encapsulation body as outer contacts.

2. The optoelectronic semiconductor component as in claim 1, wherein the central position mark is shaped as a “

+”

.

3. The optoelectronic semiconductor component as in claim 1, wherein the central position mark is a circle, a square, a triangular, a cross, a right-angle, or a combination thereof.

4. The optoelectronic semiconductor component as in claim 1, wherein a surface of said chip carrier is coated with a material for enhancing reflection.

5. The optoelectronic semiconductor component as in claim 1, wherein said annular ellipsoid of said encapsulation body is made of a highly reflective material and forms a smooth curved surface.

6. The optoelectronic semiconductor component as in claim 1, wherein said annular ellipsoid of said encapsulation body is coated with a material for enhancing reflection and forms a smooth curved surface.

7. The optoelectronic semiconductor component as in claim 1 wherein said annular ellipsoid of said encapsulation body is a smooth surface and is coated with a material for enhancing reflection.

8. The optoelectronic semiconductor component as in claim 1, wherein a material filled into said optical window part for transforming optical characteristic of said semiconductor chip is epoxy resin or silica gel, and comprises fluorescent material, light-mixed material or pigment.

9. The optoelectronic semiconductor component as in claim 1, further comprising a pair of fixing portions extending outwardly from two sides of said encapsulation body, each fixing portion having a horizontal portion parallel to an emission direction, wherein said outside connecting parts are formed on a bottom of the horizontal portions of the fixing portions, the optoelectronic semiconductor component being thereby soldered onto a PCB parallel to an emission direction.

10. The optoelectronic semiconductor component as in claim 9, wherein the pair of fixing portions are extending from the independent link-part and the chip carrier outwardly and being bended as outer electric contacts.

11. The optoelectronic semiconductor component as in claim 10, wherein each of the fixing portion is generally L-shaped from a front view.

12. The optoelectronic semiconductor component as in claim 10, wherein each of the fixing portion is formed into slab-shape and perpendicular to emission direction.

13. The optoelectronic semiconductor component as in claim 1, wherein the chip carrier is mounted with more than one semiconductor chips.

14. The optoelectronic semiconductor component as in claim 13, wherein the semiconductor chip is a LED semiconductor chip.

15. The optoelectronic semiconductor component as in claim 14, further comprising a diode-protective chip mounted on the chip carrier.

16. The optoelectronic semiconductor component as in claim 1, wherein said semiconductor chip is a radiation-emitting semiconductor chip or a radiation-receiving semiconductor chip.