Lithographic apparatus, device manufacturing method, and device manufactured thereby

• US 20050206863A1
• Filed: 05/23/2005
• Published: 09/22/2005
• Est. Priority Date: 08/03/2000
• Status: Abandoned Application

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Bisschops, Theodorus Hubertus Josephus
• Application Number:
  US11/134,463
• Publication Number:
  US 20050206863A1
• Time in Patent Office: Days
• US Class Current: 355/30
• CPC Class Codes: G03F 7/708 Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
• CPC Class Codes: G03F 7/70875 Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
• CPC Class Codes: G03F 7/70891 Temperature

Abstract

A lithographic projection apparatus including at least one temperature control member that at least partly surrounds at least one component selected from a group comprising mask and substrate tables, the projection system and an isolated reference frame for controlling the temperature of the surrounded components. The surface finish of the member is chosen to help keep the components which it partly surrounds isothermal during operation.

Claims

1. A temperature control member, comprising an enclosure that is arranged to at least partially enclose a component that is to be thermally controlled, said enclosure comprising at least one wall member, wherein said wall member is provided with a substantial absorption and emission inhibiting surface finish.

2. A temperature control member according to claim 1, wherein said absorption and emission inhibiting surface finish comprises a substantially mirror like surface finish.

3. A temperature control member according to claim 1, wherein said absorption and emission inhibiting surface finish has an emission coefficient that is less than 0.1.

4. A temperature control member according to claim 3, wherein said emission coefficient is less than 0.05.

5. A temperature control member according to claim 1, wherein a surface of said temperature control member which comprises said absorption and emission inhibiting surface finish faces towards a heat source external of a space and is at least partially surrounded by said temperature control member and that comprises said component.

6. A temperature control member according to claim 1, wherein a thermal conductivity of a material of said temperature control member is at least numeral 100 W/mK.

7. A temperature control member according to claim 1, comprising a metal selected from the group consisting of aluminum, aluminum alloys, copper and copper alloys.

8. A temperature control member according to claim 1, wherein said wall is part of a thermal baffle that is provided over an opening over a pump.

9. A temperature control member according to claim 8, wherein the pump is a vacuum pump.

10. A lithographic projection apparatus provided with a temperature control member according to claim 1.

11. A method of manufacturing an integrated circuit device using lithographic projection apparatus according to claim 10.