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Blade of wafer transfer robot, semiconductor manufacturing equipment having a transfer robot comprising the same, and method of aligning a wafer with a process chamber

  • US 20050207875A1
  • Filed: 03/10/2005
  • Published: 09/22/2005
  • Est. Priority Date: 03/18/2004
  • Status: Abandoned Application
First Claim
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1. Semiconductor manufacturing equipment comprising:

  • a load lock chamber;

    a transfer chamber to which the load lock chamber is connected;

    a process chamber connected to the transfer chamber and in which a wafer is processed; and

    a transfer robot disposed in said transfer chamber and having a working envelope encompassing the load lock and process chambers such that the transfer robot transfers wafers between the load lock and process chambers, said transfer robot comprising a blade having a plate on which a wafer is supported during its transfer by the robot, and position sensing means for sensing the relative position of a wafer on the plate of the blade.

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