Low cost electrically conductive tapes and films manufactured from conductive loaded resin-based materials

• US 20050208251A1
• Filed: 03/18/2005
• Published: 09/22/2005
• Est. Priority Date: 02/15/2001
• Status: Abandoned Application

• Current Assignee: Integral Technologies, Inc. (Schneider Electric SE)
• Original Assignee: Integral Technologies, Inc. (Schneider Electric SE)
• Inventors: Aisenbrey, Thomas
• Application Number:
  US11/083,467
• Publication Number:
  US 20050208251A1
• Time in Patent Office: Days
• US Class Current: 428/40.100
• CPC Class Codes: B29C 45/0001 characterised by the choice of material
• CPC Class Codes: B29C 45/0013 using fillers dispersed in the moulding material, e.g. metal particles
• CPC Class Codes: B29K 2995/0005 Conductive
• CPC Class Codes: B29L 2031/3456 Antennas, e.g. radomes
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 2201/0281 Conductive fibers
• CPC Class Codes: H05K 2201/09118 Moulded substrate
• CPC Class Codes: H05K 2203/0113 Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
• CPC Class Codes: H05K 3/101 by casting or moulding of conductive material
• CPC Class Codes: H05K 3/107 by filling grooves in the support with conductive material H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence
• CPC Class Codes: Y10T 428/14 Layer or component removable to expose adhesive

Abstract

Electrically conductive tapes and films are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

Claims

1. A conductive tape device comprising:

a backing layer of conductive loaded resin-based material comprising conductive materials in a base resin host; and

an adhesive layer adhered to said backing layer.

2. The device according to claim 1 wherein the percent by weight of said conductive materials is between about 20% and about 50% of the total weight of said conductive loaded resin-based material.

3. The device according to claim 1 wherein said conductive materials comprise micron conductive fiber.

4. The device according to claim 2 wherein said conductive materials further comprise conductive powder.

5. The device according to claim 1 wherein said conductive materials are metal.

6. The device according to claim 1 further comprising a release layer adhered to said adhesive layer.

7. The device according to claim 1 further comprising a second adhesive layer adhered to said backing layer on the side opposite said adhesive layer.

8. The device according to claim 1 wherein said backing layer comprises a fabric or mesh of said conductive loaded resin-based material.

9. The device according to claim 1 wherein said conductive loaded resin-based material further comprises ferromagnetic loading such that said backing layer is magnetic.

10. The device according to claim 1 further comprising a metal layer overlying said backing layer.

11. A conductive tape device comprising:

a backing layer of conductive loaded resin-based material comprising conductive materials in a base resin host wherein the weight of said conductive materials is between 20% and 50% of the total weight of said conductive loaded resin-based material; and

an adhesive layer adhered to said backing layer.

16. The device according to claim 11 further comprising a second adhesive layer adhered to said backing layer on the side opposite said adhesive layer.

17. The device according to claim 11 wherein said backing layer comprises a fabric or mesh of said conductive loaded resin-based material.

18. The device according to claim 11 wherein said conductive loaded resin-based material further comprises ferromagnetic loading such that said backing layer is magnetic.

19. The device according to claim 11 further comprising a metal layer overlying said backing layer.

12. The device according to claim 12 wherein said conductive materials are nickel plated carbon micron fiber, stainless steel micron fiber, copper micron fiber, silver micron fiber or combinations thereof.

13. The device according to claim 12 wherein said conductive materials comprise micron conductive fiber and conductive powder.

14. The device according to claim 13 wherein said conductive powder is nickel, copper, or silver.

15. The device according to claim 13 wherein said conductive powder is a non-conductive material with a metal plating of nickel, copper, silver, or alloys thereof.

20. A conductive tape device comprising:

a backing layer of conductive loaded resin-based material comprising micron conductive fiber in a base resin host wherein the weight of said micron conductive fiber is between 20% and 50% of the total weight of said conductive loaded resin-based material;

a first adhesive layer adhered to said backing layer; and

a second adhesive layer adhered to said backing layer on the side opposite said first adhesive layer.

21. The device according to claim 20 wherein said micron conductive fiber is stainless steel.

22. The device according to claim 20 further comprising conductive powder.

23. The device according to claim 20 wherein said micron conductive fiber has a diameter of between about 3 μ

m and about 12 μ

m and a length of between about 2 mm and about 14 mm.

24. The device according to claim 20 wherein said backing layer comprises a fabric or mesh of said conductive loaded resin-based material.

25. The device according to claim 20 wherein said conductive loaded resin-based material further comprises ferromagnetic loading such that said backing layer is magnetic.