Methods including fabrication of substrates and other semiconductor device components with collars on or around the contact pads thereof
First Claim
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1. A method for fabricating a substrate, comprising:
- selectively consolidating substantially unconsolidated material in accordance with a program to form at least one collar around at least a portion of at least one contact pad of a semiconductor device component.
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Abstract
Methods for fabricating carrier substrates and other semiconductor device components include disposing a collar around at least a portion of a contact. The collar may be formed by a programmed material consolidation process. The programmed material consolidation process may be effected in conjunction with a feature recognition technique, such as machine vision. Once one or more collars are in place, the semiconductor device component may be electrically connected to another semiconductor device component.
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Citations
33 Claims
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1. A method for fabricating a substrate, comprising:
selectively consolidating substantially unconsolidated material in accordance with a program to form at least one collar around at least a portion of at least one contact pad of a semiconductor device component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method for fabricating a semiconductor device component, comprising:
sequentially forming regions of at least one collar on a surface of a semiconductor device component around at least a portion of at least one contact pad exposed at the surface, the at least one collar protruding from the surface. - View Dependent Claims (14, 15, 16, 17)
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18. A method for fabricating a semiconductor device component, comprising:
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recognizing a location and orientation of at least a portion of at least one substrate; and
selectively consolidating substantially unconsolidated material based on the recognized location and orientation of at least the portion of the at least one substrate to form at least a portion of at least one collar laterally surrounding at least a portion of at least one contact pad of the substrate. - View Dependent Claims (19, 20, 21, 22, 23, 24)
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25. A method for connecting a semiconductor device to a carrier substrate, comprising:
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providing a semiconductor device having contact pads exposed at a surface thereof;
selecting a carrier substrate having contact pads on a surface thereof, the contact pads being located correspondingly to at least selected ones of the contact pads of the semiconductor device;
disposing at least one collar on the surface of the semiconductor device around at least a portion of at least one contact pad of the contact pads, the at least one collar including a plurality of sequentially adjacent, mutually adhered regions;
securing at least one conductive structure to the at least one contact pad; and
disposing the semiconductor device face down on the carrier substrate with the at least one contact pad in communication with a corresponding one of the contact pads of the carrier substrate. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33)
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Specification