Methods including fabrication of substrates and other semiconductor device components with collars on or around the contact pads thereof

• US 20050208704A1
• Filed: 05/17/2005
• Published: 09/22/2005
• Est. Priority Date: 06/08/2000
• Status: Abandoned Application

• Current Assignee: Salman Akram, Syed Sajid Ahmad
• Original Assignee: Salman Akram, Syed Sajid Ahmad
• Inventors: Akram, Salman, Ahmad, Syed Sajid
• Application Number:
  US11/130,622
• Publication Number:
  US 20050208704A1
• Time in Patent Office: Days
• US Class Current: 438/108
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: H01L 21/44 Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05552 in top view
• CPC Class Codes: H01L 2224/05572 the external layer extending out of an opening
• CPC Class Codes: H01L 2224/06131 being uniform, i.e. having a uniform pitch across the array
• CPC Class Codes: H01L 2224/0615 Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry
• CPC Class Codes: H01L 2224/10126 Bump collar
• CPC Class Codes: H01L 2224/1148 Permanent masks, i.e. masks left in the finished device, e.g. passivation layers
• CPC Class Codes: H01L 2224/1191 Forming a passivation layer after forming the bump connector
• CPC Class Codes: H01L 2224/13023 the whole bump connector protruding from the surface
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/1319 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 2224/81136 involving guiding structures, e.g. spacers or supporting members
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/12 Structure, shape, material or disposition of the bump connectors prior to the connecting process
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/742 : Apparatus for manufacturing bump connectors
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H05K 2201/10977 : Encapsulated connections
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y02P 80/30 : Reducing waste in manufacturing processes; Calculations of released waste quantities

Abstract

Methods for fabricating carrier substrates and other semiconductor device components include disposing a collar around at least a portion of a contact. The collar may be formed by a programmed material consolidation process. The programmed material consolidation process may be effected in conjunction with a feature recognition technique, such as machine vision. Once one or more collars are in place, the semiconductor device component may be electrically connected to another semiconductor device component.

Claims

1. A method for fabricating a substrate, comprising:

selectively consolidating substantially unconsolidated material in accordance with a program to form at least one collar around at least a portion of at least one contact pad of a semiconductor device component.

2. The method of claim 1, wherein selectively consolidating comprising forming the at least one collar such that at least a portion of the at least one contact pad is exposed therethrough.

3. The method of claim 2, wherein forming comprises forming at least one collar configured to laterally surround at least a base portion of the conductive structure to be secured to the at least one contact pad.

4. The method of claim 3, wherein forming at least one collar configured to laterally surround the at least a base portion comprises forming at least one collar configured to laterally surround substantially all of the conductive structure.

5. The method of claim 2, further comprising:

disposing a conductive structure in contact with the at least one contact pad through the at least one collar.

6. The method of claim 5, wherein disposing comprises defining a configuration of at least a portion of the conductive structure with the at least one collar.

7. The method of claim 6, wherein defining the configuration comprises defining a configuration of substantially all of the conductive structure with the at least one collar.

8. The method of claim 5, wherein disposing comprises placing a liquid quantity of conductive material in an aperture of the at least one collar.

9. The method of claim 1, wherein disposing at least one collar comprises disposing a plurality of collars on the surface.

10. The method of claim 1, wherein selectively consolidating comprises selectively consolidating substantially unconsolidated material to form a plurality of adjacent, mutually adhered regions of the at least one collar.

11. The method of claim 10, wherein selectively consolidating comprises selectively consolidating substantially unconsolidated material to form a plurality of at least partially superimposed, contiguous, mutually adhered layers of the at least one collar.

12. The method of claim 1, wherein selectively consolidating comprises selectively consolidating photopolymer.

13. A method for fabricating a semiconductor device component, comprising:

sequentially forming regions of at least one collar on a surface of a semiconductor device component around at least a portion of at least one contact pad exposed at the surface, the at least one collar protruding from the surface.

14. The method of claim 13, wherein sequentially forming comprises forming each of the regions from a photopolymer.

15. The method of claim 13, wherein sequentially forming comprises sequentially forming a plurality of at least partially superimposed, contiguous, mutually adhered layers to form the at least one collar.

16. The method of claim 13, further comprising:

disposing a conductive structure on the at least one contact pad.

17. The method of claim 16, wherein disposing is effected following at least a portion of the sequentially forming.

18. A method for fabricating a semiconductor device component, comprising:

recognizing a location and orientation of at least a portion of at least one substrate; and

selectively consolidating substantially unconsolidated material based on the recognized location and orientation of at least the portion of the at least one substrate to form at least a portion of at least one collar laterally surrounding at least a portion of at least one contact pad of the substrate.

19. The method of claim 18, further comprising:

storing data including at least one physical parameter of the at least one substrate and of the at least one collar in computer memory; and

using the stored data in conjunction with a machine vision system to recognize the location and orientation of the at least one substrate.

20. The method of claim 19, further comprising:

storing data including at least one physical parameter of the at least one contact pad around which the at least one collar is to be fabricated.

21. The method of claim 20, further comprising:

storing data including at least one parameter of another substrate component with which the at least one substrate is to be assembled.

22. The method of claim 19, further comprising:

using the stored data, in conjunction with the machine vision system, to effect the selectively consolidating.

23. The method of claim 18, wherein recognizing comprises recognizing a location and orientation of the at least one contact pad.

24. The method of claim 18, wherein selectively consolidating comprises stereolithographically fabricating at least the portion of the at least one collar.

25. A method for connecting a semiconductor device to a carrier substrate, comprising:

providing a semiconductor device having contact pads exposed at a surface thereof;

selecting a carrier substrate having contact pads on a surface thereof, the contact pads being located correspondingly to at least selected ones of the contact pads of the semiconductor device;

disposing at least one collar on the surface of the semiconductor device around at least a portion of at least one contact pad of the contact pads, the at least one collar including a plurality of sequentially adjacent, mutually adhered regions;

securing at least one conductive structure to the at least one contact pad; and

disposing the semiconductor device face down on the carrier substrate with the at least one contact pad in communication with a corresponding one of the contact pads of the carrier substrate.

26. The method of claim 25, wherein disposing the semiconductor device comprises connecting the at least one conductive structure to the corresponding one of the contact pads.

27. The method of claim 25, wherein, during disposing, the at least one collar prevents material of the at least one conductive structure from contacting the surface of the semiconductor device.

28. The method of claim 25, wherein securing comprises securing at least one prefabricated collar to the surface.

29. The method of claim 28, wherein securing comprises adhering the at least one prefabricated collar to the surface.

30. The method of claim 25, wherein securing comprises fabricating at least a portion of the at least one collar on the surface.

31. The method of claim 25, wherein securing the at least one conductive structure is effected before securing the at least one collar.

32. The method of claim 25, further comprising:

securing the at least one conductive structure to the corresponding one of the contact pads of the carrier substrate.

33. The method of claim 32, wherein securing the at least one conductive structure to the corresponding one of the contact pads comprises heating the at least one conductive structure to a temperature less than a reflow temperature of a material of the at least one conductive structure.