Method of making cascaded die mountings with springs-loaded contact-bond options

• US 20050208750A1
• Filed: 04/29/2005
• Published: 09/22/2005
• Est. Priority Date: 12/17/2003
• Status: Active Grant

• Current Assignee: Chester Coomer, Curtis W. Ayers, Donald J. Adams, Gui-Jia Su, John S. Hsu, Laura D. Marlino
• Original Assignee: Chester Coomer, Curtis W. Ayers, Donald J. Adams, Gui-Jia Su, John S. Hsu, Laura D. Marlino
• Inventors: Hsu, John S., Marlino, Laura D., Ayers, Curtis W., Coomer, Chester, Adams, Donald J., Su, Gui-Jia
• Granted Patent: US 7,232,710 B2
• Time in Patent Office: Days
• US Class Current: 438/614
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48139 with an intermediate bond, e.g. continuous wire daisy chain
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 25/07 the devices being of a type provided for in group H01L29/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

A cascaded die mounting device and method using spring contacts for die attachment, with or without metallic bonds between the contacts and the dies, is disclosed. One embodiment is for the direct refrigerant cooling of an inverter/converter carrying higher power levels than most of the low power circuits previously taught, and does not require using a heat sink.

Claims

1. A method for interconnecting and mounting electronic components comprising the steps of;

assembling at least three cascaded layers of electronic components, wherein said

cascaded layers further compromise at least one conducting plate and at least one of said electronic components disposed on said conducting plate;

said conducting plate further compromising a metal and a thermal expansion controlling material,

providing a means for electrically interconnecting said layers at contact points,

providing a means for connecting input power to said device,

providing a means for connecting output power to said device,

modifying said input power with said electronic components to produce said output power, and

cooling said components by direct refrigerant contact.

2. The method of claim 1 wherein said metal is a copper alloy.

3. The method of claim 1 wherein said thermal expansion controlling material is selected from the group consisting of ceramics, carbon foam, and low expansion alloy.

4. The method of claim 1 wherein said thermal expansion controlling material further comprises an array of small holes.

5. The method of claim 1 where said electronic components are metallically bonded to said conducting plate.

6. The method of claim 1 wherein said input power is DC and said output power is three-phase AC.

7. The method of claim 6 wherein each phase of said three-phase AC output power is connected to separate conducting plates on the same cascaded layer.

8. The method of claim 1 wherein said electronic components are selected from the group consisting of semiconductor switches, diodes, and semiconductor switches with built-in diodes.

9. The method of claim 1 wherein said means for electrically interconnecting said layers further comprises wirebonds.

10. The method of claim 1 wherein said means for electrically interconnecting said layers further comprises spring-loaded contacts having two ends.

11. The method of claim 10 wherein each end of said spring-loaded contacts is metallically bonded to a separate layer.

12. The method of claim 10 wherein said device further comprises at least one insulation bolt, nut, and spacer to mechanically interconnect said layers.

13. The method of claim 10 wherein said spring-loaded contacts are stamped out from the metal of said conducting plates.

14. The method of claim 10 wherein at least one of said spring-loaded contacts further comprises a conductive lead and an insulated holder disposed on a stamped tab to extend said spring-loaded contact.