Reactive sputter deposition plasma reactor and process using plural ion shower grids

• US 20050211547A1
• Filed: 06/22/2004
• Published: 09/29/2005
• Est. Priority Date: 03/26/2004
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Tanaka, Tsutomu, Ramaswamy, Kartik, Hanawa, Hiroji, Collins, Kenneth S., Nguyen, Andrew, Al-Bayati, Amir
• Application Number:
  US10/873,609
• Publication Number:
  US 20050211547A1
• Time in Patent Office: Days
• US Class Current: 204/192.120
• CPC Class Codes: C23C 14/0036 Reactive sputtering
• CPC Class Codes: C23C 14/358 Inductive energy
• CPC Class Codes: C23C 16/045 Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
• CPC Class Codes: C23C 16/507 using external electrodes, e.g. in tunnel type reactors
• CPC Class Codes: H01J 37/32357 Generation remote from the workpiece, e.g. down-stream
• CPC Class Codes: H01J 37/32449 Gas control, e.g. control of the gas flow

Abstract

A reactive sputter deposition process is carried out in a reactor chamber having a set of plural parallel ion shower grids that divide the chamber into an upper ion generation region and a lower process region, each of the ion shower grids having plural orifices in mutual registration from grid to grid, each orifice being oriented in a non-parallel direction relative to a surface plane of the respective grid. A workpiece is placed in the process region, the workpiece having a workpiece surface generally facing the surface plane of nearest one of the ion shower grids. The process includes sputtering deposition precursor species from a sputter target comprising a semiconductor species in the ion generation region, applying RF plasma source power to the ion generation region so as to generate a plasma of the deposition precursor species sputtered from the target, applying successive grid potentials to successive ones of the grids to create a flux of ions through at least some of the plural grids, and furnishing a gas species into the reactor chamber for combining with the semiconductor atoms to form molecules that deposit on the workpiece surface.

Claims

1. A reactive sputter deposition process, comprising:

providing a reactor chamber and a set of plural parallel ion shower grids that divide said chamber into an upper ion generation region and a lower process region, each of said ion shower grids having plural orifices in mutual registration from grid to grid, each orifice being oriented in a non-parallel direction relative to a surface plane of the respective grid;

placing a workpiece in said process region, said workpiece having a workpiece surface generally facing the surface plane of nearest one of said ion shower grids;

sputtering deposition precursor species from a sputter target comprising a semiconductor species in said ion generation region;

applying RF plasma source power to said ion generation region so as to generate a plasma of the deposition precursor species sputtered from said target;

applying successive grid potentials to successive ones of said grids to create a flux of ions through at least some of said plural grids; and

furnishing a gas species into said reactor chamber for combining with said semiconductor atoms to form molecules that deposit on said workpiece surface.

2. The process of claim 1 further comprising evacuating said process region at an evacuation rate sufficient to create a pressure between said ion generation and process regions whereby the pressure in said ion generation region is at least several times the pressure in said process region.

3. The process of claim 2 wherein said evacuation rate is sufficient to maintain an ion-neutral mean collision distance in said process region in excess of a multiple of a distance between said workpiece and said ion shower grid.

4. The process of claim 1 wherein:

said process is for depositing silicon dioxide on said workpiece surface;

said target comprises silicon; and

said gas species comprises oxygen.

5. The process of claim 4 wherein said process is for depositing a compound of silicon dioxide on said workpiece surface and said gas species further comprises at least one of hydrogen, nitrogen, boron, phosphorus, fluorine, carbon.

6. The process of claim 1 wherein:

said process is for depositing silicon nitride on said workpiece surface;

said target comprises silicon; and

said gas species comprises nitrogen.

7. The process of claim 6 wherein said process is for depositing a compound of silicon nitride on said workpiece surface and said gas species further comprises at least one of hydrogen, oxygen, boron, phosphorus, fluorine, carbon.

8. The process of claim 1 wherein the step of furnishing the gas species comprises injecting the gas species into the upper sputtering region, and wherein the step of sputtering comprises ionizing said gas species to perform ion bombardment of said target.

9. The process of claim 8 wherein the step of ionizing comprises applying a voltage between said semiconductor target and interior surfaces of said chamber.

10. The process of claim 9 further comprising maintaining a magnetic field near said target to promote ion bombardment of the target.

11. The process of claim 1 wherein the step of furnishing the gas species comprises injecting the gas species into the lower process region, and wherein the step of sputtering comprises ionizing an inert gas in said upper sputtering region.

12. The process of claim 11 wherein the step of ionizing comprises applying a voltage between said semiconductor target and interior surfaces of said chamber.

13. The process of claim 12 further comprising maintaining a magnetic field near said target to promote ion bombardment of the target.

14. The process of claim 1 wherein the step of sputtering comprises injecting a plasma from an external chamber into said sputtering region.

15. The process of claim 14 further comprising applying an attractive potential to said target.

16. The process of claim 1 wherein the step of applying successive attractive grid potentials to said successive ones of said grids comprises applying said attractive grid potentials to at least alternate ones of said grids and applying small repulsive potentials to remaining ones of said grids to focus ions toward centers of said orifices.

17. The process of claim 16 wherein a net potential difference across said plural grids is attractive to an ion flux passing from the uppermost one of said grids to the lowermost one of said grids.

18. The process of claim 1 wherein the step of applying grid potentials comprises collimating said flux of ions to an angular distribution in said process region that is sufficiently narrow for particles in said process region to deposit in the bottom of an opening in said workpiece surface having a minimum opening size of about 65 nm or less and an aspect ratio of 5 or greater so as to fill said opening from the bottom completely to the top of the opening.

19. The process of claim 1 further comprising controlling the potential of the plasma in said ion generation region by controlling the potential of the uppermost one of said grids.

20. The process of claim 1 further comprising controlling the temperature of said set of ion shower grids.

21. The process of claim 20 wherein the step of controlling the temperature comprises pumping a thermal control fluid through fluid flow passages thermally coupled to said set of ion shower grids and controlling the temperature of said thermal control fluid.

22. The process of claim 1 further comprising providing neutralization electrons in the vicinity of said workpiece.

23. The process of claim 22 wherein the step of providing neutralization electrons comprises establishing a magnetic field near said workpiece having sufficient magnetic flux to trap electrons near said workpiece surface.

24. The process of claim 22 wherein the step of providing neutralization electrons comprises generating a flow of electrons from an electron gun toward said workpiece surface.

25. The process of claim 22 wherein the step of providing neutralization electrons comprises injecting an electron-donor gas into said process region and near said workpiece.

26. The process of claim 25 wherein said electron-donor gas comprises Zenon.

27. The process of claim 22 wherein the step of providing neutralization electrons comprises furnishing a plasma into said process region from an external plasma source.

28. The process of claim 1 wherein the step of applying plasma source power comprises capacitively coupling plasma source power into said ion generation region.

29. The process of claim 28 wherein the step of capacitively coupling plasma source power comprises applying RF power from an RF generator between a ceiling of said reactor and one of (a) the uppermost one of said grids, (b) a side wall of said ion generation region of said reactor.

30. The process of claim 29 further comprising a bias potential to said workpiece.

31. The process of claim 29 further comprising holding said wafer and at least one of said grids at the same potential.

32. The process of claim 30 wherein said bias potential includes an RF voltage, said process further comprising controlling ion energy near the workpiece surface by controlling the frequency of said RF voltage.

33. The process of claim 28 wherein said plasma source power comprises RF power and each of said grid potentials comprises at least one of:

(a) a pulsed D.C. voltage, (b) an RF voltage, (c) a D.C. voltage, (d) a pulsed RF voltage.

34. The process of claim 32 wherein each of said grid potentials comprises a mixture of at least two of (a) a pulsed D.C. voltage, (b) an RF voltage, (c) a D.C. voltage, (d) a pulsed RF voltage.

35. The process of claim 1 wherein the step of applying plasma source power comprises inductively coupling plasma source power into said ion generation region.

36. The process of claim 35 further comprising holding said workpiece and at least one of said grids at the same voltage.

37. The process of claim 35 further comprising a bias potential to said workpiece.

38. The process of claim 37 wherein said bias potential includes an RF voltage, said process further comprising controlling ion energy near the workpiece surface by controlling the frequency of said RF voltage.

39. The process of claim 35 wherein said plasma source power comprises RF power and each of said grid potentials comprises at least one of:

(a) a pulsed D.C. voltage, (b) an RF voltage, (c) a D.C. voltage, (d) a pulsed RF voltage.

40. The process of claim 39 wherein each of said grid potentials comprises a mixture of at least two of (a) a pulsed D.C. voltage, (b) an RF voltage, (c) a D.C. voltage, (d) a pulsed RF voltage.

41. The process of claim 1 wherein the step of applying plasma source power comprises coupling microwave plasma source power into said ion generation region.

42. The process of claim 41 further comprising holding said wafer and at least one of said grids at the same voltage.

43. The process of claim 41 further comprising a bias potential to said workpiece.

44. The process of claim 43 wherein said bias potential includes an RF voltage, said process further comprising controlling ion energy near the workpiece surface by controlling the frequency of said RF voltage.

45. The process of claim 41 wherein each of said grid potentials comprises at least one of:

(a) a pulsed D.C. voltage, (b) an RF voltage, (c) a D.C. voltage, (d) a pulsed RF voltage.

46. The process of claim 41 wherein said each of said grid potentials comprises a mixture of at least two of (a) a pulsed D.C. voltage, (b) an RF voltage, (c) a D.C. voltage, (d) a pulsed RF voltage.

47. The process of claim 1 wherein the step of applying plasma source power comprises generating a torroidal plasma current in said ion generation region through an external reentrant conduit coupled across said ion generation region and coupling the RF plasma source power into the external reentrant conduit.

48. The process of claim 47 further comprising holding said workpiece and at least one of said grids at the same voltage.

49. The process of claim 47 further comprising a bias potential to said workpiece.

50. The process of claim 49 wherein said bias potential includes an RF voltage, said process further comprising controlling ion energy near the workpiece surface by controlling the frequency of said RF voltage.

51. The process of claim 47 wherein each of said grid potentials comprises at least one of:

(a) a pulsed D.C. voltage, (b) an RF voltage, (c) a D.C. voltage, (d) a pulsed RF voltage.

52. The process of claim 47 wherein each of said grid potentials comprises a mixture of at least two of (a) a pulsed D.C. voltage, (b) an RF voltage, (c) a D.C. voltage, (d) a pulsed RF voltage.

53. The process of claim 1 wherein said deposition precursor species comprise silicon and oxygen and said process deposits silicon dioxide.

54. The process of claim 53 wherein said deposition precursor further comprises at least one of the following additive species:

hydrogen, fluorine, phosphorus, boron, carbon.

55. The process of claim 1 wherein said deposition precursor species comprise silicon and nitrogen and said process deposits silicon nitride.

56. The process of claim 55 wherein said deposition precursor further comprises at least one of the following additive species:

hydrogen, fluorine, phosphorus, boron, carbon.

57. The process of claim 1 further the following steps carried out prior to the step of placing a workpiece in said process region:

depositing a layer of a process-compatible material on reactor chamber interior surfaces.

58. The process of claim 57 wherein the step of depositing a layer of a process-compatible material comprises:

introducing a process gas comprising a precursor of said process-compatible material into said ion generation region;

applying plasma source power into said ion generation region.

59. The process of claim 58 further comprising applying an ion extraction potential to at least one of said grids.

60. The process of claim 57 wherein the step of depositing a layer of a process-compatible material comprises furnishing into at least one of said ion generation and process regions ions or radicals of said process-compatible material from a plasma source external of said chamber.

61. The process of claim 1 further comprising the following steps carried out after the step of depositing a layer of a process-compatible material:

removing said workpiece from said chamber;

cleaning the reactor chamber interior surfaces.

62. The process of claim 61 wherein the step of cleaning the reactor interior chamber surfaces comprises:

introducing a process gas comprising an etchant species into said ion generation region;

applying plasma source power into said ion generation region.

63. The process of claim 62 further comprising applying an ion extraction potential to at least one of said grids.

64. The process of claim 61 wherein the step of cleaning the reactor interior surfaces comprises:

furnishing into at least one of said ion generation and process regions ions or radicals of an etchant species.

65. The process of claim 1 further comprising maintaining said workpiece and the grid nearest said workpiece at generally the same electrical potential.

66. The process of claim 1 further comprising:

traversing said workpiece and said grids relative to one another so as to scan an ion beam from said grids across said workpiece.

67. The process of claim 66 wherein said workpiece has a diameter exceeding that of said grids.

68. The process of claim 1 further comprising tilting said workpiece relative to said grids.

69. The process of claim 1 further comprising thermally coupling said workpiece to a workpiece support pedestal and thermally cooling or heating said workpiece support pedestal.

70. The process of claim 69 further comprising electrostatically chucking said workpiece on said workpiece support pedestal.

71. The process of claim 1 wherein said ion flux extends through all of said grids and is incident on said workpiece.

72. The process of claim 1 further comprising neutralizing at least a portion of said ion flux in one of said grids nearest said workpiece to produce a flux of neutrals incident on said workpiece.

73. The process of claim 1 further comprising a bias potential to said workpiece.

74. The process of claim 73 further comprising maintaining said plasma at a reference potential and wherein the steps of applying said grid voltages and said bias voltage comprises applying ion-attractive voltages of successively greater magnitude to successive ones of said grids and applying the greatest ion-attractive voltage to said workpiece.

75. The process of claim 74 wherein said reference potential is at least nearly equal to RF ground and said ion-attractive voltages are negative voltages.

76. The process of claim 30 wherein said bias potential includes an RF voltage, said process further comprising controlling ion energy near the workpiece surface by controlling the voltage of said RF voltage.

77. The process of claim 37 wherein said bias potential includes an RF voltage, said process further comprising controlling ion energy near the workpiece surface by controlling the voltage of said RF voltage.

78. The process of claim 43 wherein said bias potential includes an RF voltage, said process further comprising controlling ion energy near the workpiece surface by controlling the voltage of said RF voltage.

79. The process of claim 49 wherein said bias potential includes an RF voltage, said process further comprising controlling ion energy near the workpiece surface by controlling the voltage of said RF voltage.