Device for reactive sputtering
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Accused Products
Abstract
A device for reactive sputtering, wherein a cathode is applied a discharge voltage for a plasma, and a working gas and a reactive gas are introduced into a sputter chamber. The total gas flow in the sputter chamber is controlled with the aid of a valve, while the ratio of the partial pressures of both gases is kept constant.
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Citations
16 Claims
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1-8. -8. (canceled)
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9. A device for reactive sputtering, comprising:
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at least one cathode to which is applied a discharge voltage for a plasma;
at least one working gas and at least one reactive gas in a sputter chamber;
a controllable valve with which total gas flow into the sputter chamber can be controlled; and
a regulation circuit, with which the ratio of partial pressures of the at least one working gas and at least one reactive gas is kept constant. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A method for the regulation of the discharge voltage during reactive sputtering in an inline installation, comprising moving several area substrates sequentially through a sputter chamber so that between two area substrates a gap is formed, and regulating the discharge voltage by varying a total gas stream.
Specification