Inspection method and inspection apparatus
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Accused Products
Abstract
There is established an easier inspection method with which it is not required to set up probes on wires. Also, there is provided an inspection apparatus using this inspection method. With the inspection apparatus or inspection method, primary coils of an inspection substrate and secondary coils of a device substrate are superimposed on each other so that a certain space is maintained therebetween. An AC signal is inputted into the primary coils, thereby generating an electromotive force in each secondary coil by electromagnetic induction. Then, each circuit provided on the device substrate is driven using the electromotive force and information possessed by an electromagnetic wave or electric field generated in this circuit is monitored, thereby detecting each defective spot.
70 Citations
101 Claims
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1-77. -77. (canceled)
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78. A device comprising:
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a circuit comprising a thin film transistor over a substrate;
a coil electrically connected to the circuit over the substrate. - View Dependent Claims (84, 90, 96)
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79. A device comprising:
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a first circuit comprising a thin film transistor over a substrate;
a rectifier circuit electrically connected to the first circuit over the substrate;
a coil electrically connected to the rectifier circuit over the substrate. - View Dependent Claims (85, 91, 97)
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80. A device comprising:
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a first circuit comprising a thin film transistor over a substrate;
a waveform shaping circuit electrically connected with the first circuit over the substrate;
a coil electrically connected to the waveform shaping circuit over the substrate. - View Dependent Claims (86, 92, 98)
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81. A device comprising:
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a first circuit comprising a thin film transistor over a substrate;
a second circuit comprising a resister and a capacitor, electrically connected to the first circuit over a substrate; and
a coil electrically connected to the second circuit over the substrate. - View Dependent Claims (87, 93, 99)
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82. A device comprising:
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a first circuit comprising a thin film transistor over a substrate;
a second circuit comprising a diode, electrically connected to the first circuit over a substrate; and
a coil electrically connected to the second circuit over the substrate. - View Dependent Claims (88, 94, 100)
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83. A device comprising:
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a first circuit comprising a thin film transistor over a substrate;
a second circuit comprising a diode, a capacitor and a resister, electrically connected to the first circuit over a substrate; and
a coil electrically connected to the second circuit over the substrate. - View Dependent Claims (89, 95, 101)
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Specification