Semiconductor package with build-up structure and method for fabricating the same
First Claim
1. A semiconductor package with a build-up structure, comprising:
- a rigid base;
a rigid frame having at least one through hole and fixed onto the rigid base;
at least one chip received in the through hole of the rigid frame and mounted on the rigid base, wherein a gap is formed between the chip and the rigid frame;
a medium filled in the gap between the chip and the rigid frame;
a build-up structure formed on the rigid frame and the chip and electrically connected to the chip; and
a plurality of conductive elements electrically connected to the build-up structure, for allowing the chip to be electrically connected to external devices.
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Accused Products
Abstract
A semiconductor package with a build-up structure is provided, which includes a rigid base, a rigid frame having a through hole and fixed onto the rigid base, at least one chip received in the through hole of the rigid frame, a medium filled in a gap between the chip and the rigid frame, a build-up structure formed on the chip and the rigid frame and electrically connected to the chip, and a plurality of conductive elements bonded to the build-up structure to electrically connect the chip to external devices. The use of the rigid base and rigid frame can avoid structural warpage, cracking, delamination and a popcorn effect of the semiconductor package. A method for fabricating the semiconductor package is also provided.
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Citations
23 Claims
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1. A semiconductor package with a build-up structure, comprising:
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a rigid base;
a rigid frame having at least one through hole and fixed onto the rigid base;
at least one chip received in the through hole of the rigid frame and mounted on the rigid base, wherein a gap is formed between the chip and the rigid frame;
a medium filled in the gap between the chip and the rigid frame;
a build-up structure formed on the rigid frame and the chip and electrically connected to the chip; and
a plurality of conductive elements electrically connected to the build-up structure, for allowing the chip to be electrically connected to external devices. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for fabricating a semiconductor package with a build-up structure, comprising the steps of:
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preparing a module board comprising a plurality of rigid frames arranged as an array, each of the rigid frames having at least one through hole;
fixing the module board onto a rigid base;
mounting at least one chip in each of the through holes of the rigid frames and on the rigid base, wherein a predetermined gap is formed between each of the chips and the corresponding one of the rigid frames of the module board;
filling a medium into the gaps such that each of the chips and the corresponding rigid frame are separated by the medium;
forming a build-up structure on the module board and the chips, the build-up structure being electrically connected to the chips, and electrically connecting a plurality of conductive elements to the build-up structure; and
performing a singulation process to form individual semiconductor packages with the build-up structure. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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17. A method for fabricating a semiconductor package with a build-up structure, comprising the steps of:
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preparing a rigid base;
preparing a module board comprising a plurality of rigid frames arranged as an array, each of the rigid frames having at least one through hole;
mounting at least one chip on the rigid base at a position corresponding to each of the through holes of the rigid frames;
fixing the module board onto the rigid base such that each of the chips is received in a corresponding one of the through holes of the rigid frames, and a predetermined gap is formed between each of the chips and the corresponding rigid frame;
filling a medium into the gaps such that each of the chips and the corresponding rigid frame are separated by the medium;
forming a build-up structure on the module board and the chips, the build-up structure being electrically connected to the chips, and electrically connecting a plurality of conductive elements to the build-up structure; and
performing a singulation process to form individual semiconductor packages with the build-up structure. - View Dependent Claims (18, 19, 20, 21, 22, 23)
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Specification