System and method of integrating optics into an IC package
First Claim
1. An integrated circuit (“
- IC”
) package for detecting light from at least one light source, comprising;
a housing, said housing having a predetermined spectral transmittance;
a sensor, positioned within said housing;
an opaque mask, applied to said housing, said opaque mask having a hole aligned with said sensor such that said light'"'"'s centroid is detected by said sensor.
4 Assignments
0 Petitions
Accused Products
Abstract
An apparatus and method of integrating optics into an IC package is for detecting light from at least one light source is disclosed. The apparatus has a housing, which has a predetermined spectral transmittance. A sensor is positioned within the housing. An opaque mask is applied to the housing, where the opaque mask has a hole aligned with the sensor such that the light'"'"'s centroid is detected by the sensor. In one embodiment, the apparatus further comprises a substrate for positioning and stabilizing the sensor in the housing, an analog filter and amplification module (“AFA”) for filtering and amplifying signals from the sensor and generating a second signal, and a digital signal processor (“DSP”) for generating a coordinate system by extracting frequency components from the AFA output signal.
102 Citations
36 Claims
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1. An integrated circuit (“
- IC”
) package for detecting light from at least one light source, comprising;
a housing, said housing having a predetermined spectral transmittance;
a sensor, positioned within said housing;
an opaque mask, applied to said housing, said opaque mask having a hole aligned with said sensor such that said light'"'"'s centroid is detected by said sensor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
- IC”
-
16. A multi-chip module (“
- MCM”
) for detecting at least one light source, comprising;
an integrated package that is essentially transparent relative to the wavelength of said light source;
a substrate mounted within said n integrated package;
a sensor, mounted on said substrate within said n integrated package;
an opaque mask, coupled to said integrated package, said opaque mask having an aperture formed thereon, said aperture being sized and aligned with said sensor such that an optical path is formed from said light source to said sensor through said opaque mask. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
- MCM”
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31. A method of integrating optics into an integrated circuit package for detecting at least one light source, comprising:
-
providing a substrate;
mounting an image sensor on said substrate;
enclosing said image sensor within a transparent housing, said transparent housing having a predetermined spectral transmittance;
applying an opaque mask to said transparent housing, said opaque mask having a transparent aperture, said aperture being aligned with said sensor such that an optical path is formed from said light source through said aperture to said image sensor. - View Dependent Claims (32, 33, 34, 35, 36)
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Specification