Environmental control method and apparatus for electronic device enclosures

• US 20050213306A1
• Filed: 03/25/2005
• Published: 09/29/2005
• Est. Priority Date: 03/25/2004
• Status: Abandoned Application

• Current Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Original Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Inventors: Bittler, David, Bendzel, Douglas S., Vos, David L., Brown, Jonathan M.
• Application Number:
  US11/089,673
• Publication Number:
  US 20050213306A1
• Time in Patent Office: Days
• US Class Current: 361/714
• CPC Class Codes: H05K 7/20609 Air circulating in closed loop within cabinets wherein heat is removed through air-to-liquid heat-exchanger

Abstract

A method and apparatus for housing electronic components, such as commercial-off-the-shelf (COTS) electronics, in a chamber, or cocoon, so as to protect the components from environmental conditions outside the chamber. In one embodiment, a heat exchanger used to transfer heat between the chamber and its exterior may be incorporated into a wall of the chamber, e.g., located at a sidewall of the chamber. The heat exchanger may use a liquid to transfer heat between the heat exchanger and air in the chamber.

Claims

1. An enclosure for housing electronic devices comprising:

one or more walls, including at least one sidewall, that define a chamber within which electronic devices are located, the chamber having an environment suitable for the operation of the electronic devices and that is different from an environment outside of the chamber; and

a heat exchanger at least partially located in the chamber at a sidewall of the chamber, the heat exchanger using a liquid material to transfer heat between the chamber and an area outside of the chamber, wherein heat generated by the electronic devices is transferred by air to the heat exchanger.

2. The enclosure of claim 1, wherein:

the heat exchanger is integrally formed with at least one sidewall.

3. The enclosure of claim 1, wherein a portion of the heat exchanger forms a portion of the sidewall of the enclosure.

4. The enclosure of claim 1, wherein condensate formed on the heat exchanger in the chamber is channeled to a bottom of the enclosure.

5. The enclosure of claim 1, wherein the chamber is sealed from an exterior environment to protect the electronic components from exterior environmental conditions outside the chamber.

6. The enclosure of claim 5, wherein the exterior environmental conditions include ambient humidity, temperature, dust, chemicals, air pressure, physical impact, or vibration.

7. The enclosure of claim 1, further comprising at least one connection between at least one device outside of the chamber and at least one electronic device in the chamber.

8. The enclosure of claim 1, wherein the enclosure is constructed and arranged to be located in or on a vehicle, the vehicle being a fixed wing aircraft, a rotary wing aircraft, a wheeled vehicle, a track vehicle, or a boat.

9. The enclosure of claim 1, wherein the chamber is constructed and arranged so that a fan included with at least one electronic device moves air to cool at least a portion of the electronic device and causes air to move near the heat exchanger.

10. An enclosure for housing electronic devices comprising:

one or more walls that define a chamber within which electronic devices are located, the chamber having an environment suitable for the operation of the electronic devices and that is different from an environment outside of the chamber; and

a heat exchanger incorporated into at least one wall of the chamber, the heat exchanger using a liquid material to transfer heat between the chamber and an area outside of the chamber, wherein heat generated by the electronic devices is transferred by air to the heat exchanger.

11. The enclosure of claim 10, wherein the one or more walls includes at least one sidewall, and a portion of the heat exchanger forms a portion of a sidewall of the enclosure.

12. The enclosure of claim 10, wherein condensate formed on the heat exchanger in the chamber is channeled to a bottom of the enclosure.

13. The enclosure of claim 10, wherein the chamber is sealed from an exterior environment to protect the electronic components from exterior environmental conditions outside the chamber.

14. The enclosure of claim 10, wherein the liquid material is a single-phase liquid material.

15. The enclosure of claim 10, further comprising at least one connection between at least one device outside of the chamber and at least one electronic device in the chamber, the at least one connection providing electric power or communications.

16. The enclosure of claim 10, wherein the enclosure is constructed and arranged to be located in or on a vehicle, the vehicle being a fixed wing aircraft, a rotary wing aircraft, a wheeled vehicle, a track vehicle, rail car, or a boat;

and

wherein heat transferred to the liquid material is subsequently transferred from the liquid material to a portion of the vehicle.

17. The enclosure of claim 16, wherein heat is transferred from the liquid material to contents of a fuel tank.

18. The enclosure of claim 10, wherein the chamber is constructed and arranged so that a fan included with at least one electronic device moves air to cool at least a portion of the electronic device and causes air to move near the heat exchanger.

19. A method for providing a suitable environment for electronic devices, comprising:

providing an enclosure having walls that define a chamber isolated from external environmental conditions and within which one or more electronic devices are housed; and

transferring heat from air in the chamber heated by one or more electronic devices to a liquid material located in a heat exchanger that is incorporated into at least one of the walls of the enclosure.

20. The method of claim 19, further comprising:

moving heated air in or near an electronic device to a location near the heat exchanger using a fan that is part of the electronic device.