Chemical vapor deposition plasma process using an ion shower grid

• US 20050214477A1
• Filed: 06/22/2004
• Published: 09/29/2005
• Est. Priority Date: 03/26/2004
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Ramaswamy, Kartik, Tanaka, Tsutomu, Hanawa, Hiroji, Collins, Kenneth S., Nguyen, Andrew, Al-Bayati, Amir
• Granted Patent: US 7,244,474 B2
• Time in Patent Office: Days
• US Class Current: 427/569
• CPC Class Codes: C23C 16/402 Silicon dioxide
• CPC Class Codes: C23C 16/452 by activating reactive gas streams before their introduction into the reaction chamber, e.g. by ionisation or addition of reactive species
• CPC Class Codes: C23C 16/517 using a combination of discharges covered by two or more of groups C23C16/503 - C23C16/515

Abstract

A chemical vapor deposition process is carried out in a reactor chamber with an ion shower grid that divides the chamber into an upper ion generation region and a lower process region, the ion shower grid having plural orifices oriented in a non-parallel direction relative to a surface plane of the ion shower grid. A workpiece is placed in the process region facing the ion shower grid, the workpiece having a workpiece surface generally facing the surface plane of the ion shower grid. A gas mixture is furnished comprising deposition precursor species into the ion generation region and the process region is evacuated at an evacuation rate sufficient to create a pressure drop across the ion shower grid from the ion generation region to the process region whereby the pressure in the ion generation region is at least several times the pressure in the process region. A layer of material of a desired thickness is deposited on the workpiece by: (a) applying plasma source power to generate a plasma of the deposition precursor species in the ion generation region, and (b) applying a grid potential to the ion shower grid to create a flux of ions from the plasma through the grid and into the process region.

Claims

1. A chemical vapor deposition process, comprising:

providing a reactor chamber with an ion shower grid that divides said chamber into an upper ion generation region and a lower process region, said ion shower grid having plural orifices oriented in a non-parallel direction relative to a surface plane of said ion shower grid;

placing a workpiece in said process region facing said ion shower grid, said workpiece having a workpiece surface generally facing the surface plane of said ion shower grid;

furnishing a gas mixture comprising deposition precursor species into said ion generation region;

evacuating said process region at an evacuation rate sufficient to create a pressure drop across said ion shower grid from said ion generation region to said process region whereby the pressure in said ion generation region is at least several times the pressure in said process region;

depositing a layer of material of a desired thickness on said workpiece by;

(a) applying plasma source power to generate a plasma of said deposition precursor species in said ion generation region, and (b) applying a grid potential to said ion shower grid to create a flux of ions from the plasma through said grid and into said process region.

2. The process of claim 1 wherein said evacuation rate is sufficient to maintain an ion-neutral mean collision distance in said process region in excess of a multiple of a distance between said workpiece and said ion shower grid.

3. The process of claim 1 wherein the steps of (a) applying plasma source power and (b) applying a grid potential are comprised in a single step of applying a potential between said ion shower grid and said ion generation region.

4. The process of claim 3 wherein the step of applying a grid potential between said grid and said ion generation region comprises applying a potential between said grid and a wall of said ion generation region.

5. The process of claim 4 wherein said grid potential is at least one of:

(a) a pulsed D.C. potential, (b) an RF potential, (c) a D.C. potential, (d) a pulsed RF potential.

6. The process of claim 1 further comprising controlling the temperature of said ion shower grid.

7. The process of claim 6 wherein the step of controlling the temperature of said ion shower grid comprises pumping a thermal transfer fluid through fluid flow passages thermally coupled to said ion shower grid and controlling the temperature of said thermal transfer fluid.

8. The process of claim 1 further comprising providing neutralization electrons in the vicinity of said workpiece.

9. The process of claim 8 wherein the step of providing neutralization electrons comprises establishing a magnetic field near said workpiece having sufficient magnetic flux to trap electrons near said workpiece surface.

10. The process of claim 8 wherein the step of providing neutralization electrons comprises generating a flow of electrons from an electron gun toward said workpiece surface.

11. The process of claim 8 wherein the step of providing neutralization electrons comprises injecting an electron-donor gas into said process region and near said workpiece.

12. The process of claim 11 wherein said electron-donor gas comprises Zenon.

13. The process of claim 8 wherein the step of providing neutralization electrons comprises providing ions from an external plasma source into said process region.

14. The process of claim 1 wherein the step of applying plasma source power comprises capacitively coupling plasma source power into said ion generation region and the step of applying a grid potential comprises applying a grid potential between said plasma and said ion shower grid.

15. The process of claim 14 wherein the step of capacitively coupling plasma source power comprises applying RF power from an RF generator between a ceiling of said reactor and one of (a) said grid, (b) a side wall of said reactor.

16. The process of claim 14 wherein the step of applying a grid potential between said plasma and said ion shower grid comprises applying a potential from a grid potential source between a chamber surface of said ion generation region and said ion shower grid.

17. The process of claim 16 further comprising applying a bias potential to said workpiece, whereby said plasma, said grid and said workpiece have successively greater attractive potentials for ions.

18. The process of claim 14 wherein said plasma source power comprises RF power and said grid potential comprises at least one of:

(a) a pulsed D.C. voltage, (b) an RF voltage, (c) a D.C. voltage, (d) a pulsed RF voltage.

19. The process of claim 18 wherein said grid potential comprises a mixture of at least two of (a) a pulsed D.C. voltage, (b) an RF voltage, (c) a D.C. voltage, (d) a pulsed RF voltage.

20. The process of claim 18 further comprising maintaining said workpiece at generally the same voltage as said grid.

21. The process of claim 1 wherein the step of applying plasma source power comprises inductively coupling plasma source power into said ion generation region and the step of applying said grid potential comprises applying a grid potential between said plasma and said ion shower grid.

22. The process of claim 21 wherein the step of applying a grid potential between said plasma and said ion shower grid comprises applying a potential from a grid potential source between a chamber surface of said ion generation region and said ion shower grid.

23. The process of claim 21 further comprising applying a bias potential to said workpiece, whereby said plasma, said grid and said workpiece have successively greater attractive potentials for ions.

24. The process of claim 21 wherein said plasma source power comprises RF power and said grid potential comprises at least one of:

(a) a pulsed D.C. voltage, (b) an RF voltage, (c) a D.C. voltage, (d) a pulsed RF voltage.

25. The process of claim 24 wherein said grid potential comprises a mixture of at least two of (a) a pulsed D.C. voltage, (b) an RF voltage, (c) a D.C. voltage, a pulsed RF voltage.

26. The process of claim 21 further comprising maintaining said workpiece at generally the same voltage as said workpiece.

27. The process of claim 1 wherein the step of applying plasma source power comprises coupling microwave plasma source power into said ion generation region and the step of applying said grid potential comprises applying a grid potential between said plasma and said ion shower grid.

28. The process of claim 27 wherein the step of applying a grid potential between said plasma and said ion shower grid comprises applying a potential from a grid potential source between a chamber surface of said ion generation region and said ion shower grid.

29. The process of claim 27 further comprising applying a bias potential to said workpiece, whereby said plasma, said grid and said workpiece have successively greater attractive potentials for ions.

30. The process of claim 27 wherein said grid potential comprises at least one of:

(a) a pulsed D.C. voltage, (b) an RF voltage, (c) a D.C. voltage, (d) a pulsed RF voltage.

31. The process of claim 30 wherein said grid potential comprises a mixture of at least two of (a) a pulsed D.C. voltage, (b) an RF voltage, (c) a D.C. voltage, (d) a pulsed RF voltage.

32. The process of claim 30 further comprising maintaining said workpiece at generally the same voltage as said grid.

33. The process of claim 1 wherein the step of applying plasma source power comprises generating a torroidal plasma current in said ion generation region through an external reentrant conduit coupled across said ion generation region, and the step of applying said grid potential comprises applying a grid potential between said plasma and said ion shower grid.

34. The process of claim 33 wherein the step of applying a grid potential between said plasma and said ion shower grid comprises applying a potential from a grid potential source between a chamber surface of said ion generation region and said ion shower grid.

35. The process of claim 33 further comprising applying a bias potential to said workpiece, whereby said plasma, said grid and said workpiece have successively greater attractive potentials for ions.

36. The process of claim 34 wherein said plasma source power comprises RF power and said grid potential comprises at least one of:

(a) a pulsed D.C. voltage, (b) an RF voltage, (c) a D.C. voltage, (d) a pulsed RF voltage.

37. The process of claim 36 wherein said grid potential comprises a mixture of at least two of (a) a pulsed D.C. voltage, (b) an RF voltage, (c) a D.C. voltage, (d) a pulsed RF voltage.

38. The process of claim 36 further comprising maintaining said workpiece at generally the same voltage as said grid.

39. The process of claim 1 wherein said deposition precursor species comprise silicon and oxygen and said process deposits silicon dioxide.

40. The process of claim 39 wherein said deposition precursor further comprises at least one of the following additive species:

hydrogen, flourine, phosphorus, boron, carbon.

41. The process of claim 1 wherein said deposition precursor species comprise silicon and nitrogen and said process deposits silicon nitride.

42. The process of claim 41 wherein said deposition precursor further comprises at least one of the following additive species:

hydrogen, flourine, phosphorus, boron, carbon.

43. The process of claim 1 further comprising:

applying a bias voltage to said workpiece, said bias voltage comprising an RF bias voltage;

adjusting ion energy at said workpiece surface by adjusting the frequency of said RF bias voltage.

44. The process of claim 1 wherein the step of applying a grid potential comprises holding the potential of said plasma at a reference potential and applying a negative voltage to said ion shower grid relative to said reference potential.

45. The process of claim 44 wherein said reference potential is ground.

46. The process of claim 44 further comprising applying a bias voltage to said workpiece, wherein the step of applying a grid potential and the step of applying a bias voltage comprise holding said plasma at a reference potential and applying successively greater negative voltages to said ion shower grid and to said workpiece, respectively, relative to said reference potential.

47. The process of claim 46 wherein said reference potential is ground.

48. The process of claim 1 further the following steps carried out prior to the step of placing a workpiece in said process region:

depositing a layer of a process-compatible material on reactor chamber interior surfaces.

49. The process of claim 48 wherein the step of depositing a layer of a process-compatible material comprises:

introducing a process gas comprising a precursor of said process-compatible material into said ion generation region;

applying plasma source power into said ion generation region.

50. The process of claim 49 further comprising applying an ion extraction potential to said grid.

51. The process of claim 48 wherein the step of depositing a layer of a process-compatible material comprises furnishing into at least one of said ion generation and process regions ions or radicals of said process-compatible material from a plasma source external of said chamber.

52. The process of claim 1 further comprising the following steps carried out after the step of depositing a layer of a process-compatible material:

removing said workpiece from said chamber;

cleaning the reactor chamber interior surfaces.

53. The process of claim 52 wherein the step of cleaning the reactor interior chamber surfaces comprises:

introducing a process gas comprising an etchant species into said ion generation region;

applying plasma source power into said ion generation region and applying an ion extraction potential to said grid.

54. The process of claim 52 wherein the step of cleaning the reactor interior surfaces comprises:

furnishing into at least one of said ion generation and process regions ions or radicals of an etchant species.

55. The process of claim 1 further comprising maintaining said workpiece and said grid at generally the same electrical potential.

56. The process of claim 1 further comprising:

traversing said workpiece and said grid relative to one another so as to scan an ion beam from said grid across said workpiece.

57. The process of claim 56 wherein said workpiece has a diameter exceeding that of said grid.

58. The process of claim 1 further comprising tilting said workpiece relative to said grid.

59. The process of claim 1 where in said workpiece comprises a surface having an opening to be filled with a diameter on the order of 65 nm or less with aspect ratios on the order of 5 or greater, and wherein the step of applying a potential to said grid collimates said flux of ions to a restricted angular distribution corresponding to said diameter and aspect ratio by extracting said ion flux through said grid.

60. The process of claim 1 further comprising thermally coupling said workpiece to a workpiece support pedestal and thermally cooling or heating said workpiece support pedestal.

61. The process of claim 54 further comprising electrostatically chucking said workpiece on said workpiece support pedestal.

62. The process of claim 14 further comprising applying a bias potential to said workpiece, wherein said bias potential includes an RF voltage, said process further comprising controlling ion energy near the workpiece surface by controlling the voltage of said RF voltage.

63. The process of claim 21 further comprising applying a bias potential to said workpiece, wherein said bias potential includes an RF voltage, said process further comprising controlling ion energy near the workpiece surface by controlling the voltage of said RF voltage.

64. The process of claim 27 further comprising applying a bias potential to said workpiece, wherein said bias potential includes an RF voltage, said process further comprising controlling ion energy near the workpiece surface by controlling the voltage of said RF voltage.

65. The process of claim 33 further comprising applying a bias potential to said workpiece, wherein said bias potential includes an RF voltage, said process further comprising controlling ion energy near the workpiece surface by controlling the voltage of said RF voltage.

66. The process of claim 14 further comprising applying a bias potential to said workpiece, wherein said bias potential includes an RF voltage, said process further comprising controlling ion energy near the workpiece surface by controlling the frequency of said RF voltage.

67. The process of claim 21 further comprising applying a bias potential to said workpiece, wherein said bias potential includes an RF voltage, said process further comprising controlling ion energy near the workpiece surface by controlling the frequency of said RF voltage.

68. The process of claim 27 further comprising applying a bias potential to said workpiece, wherein said bias potential includes an RE voltage, said process further comprising controlling ion energy near the workpiece surface by controlling the frequency of said RE voltage.

69. The process of claim 33 further comprising applying a bias potential to said workpiece, wherein said bias potential includes an RE voltage, said process further comprising controlling ion energy near the workpiece surface by controlling the frequency of said RE voltage.