Method of forming a pattern, conductive patterned material, and method of forming a conductive pattern

• US 20050214550A1
• Filed: 03/25/2005
• Published: 09/29/2005
• Est. Priority Date: 03/25/2004
• Status: Abandoned Application

• Current Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Original Assignee: Fuji Photo Film Co Limited (Fujifilm Holdings Corporation)
• Inventors: Kawamura, Koichi
• Application Number:
  US11/088,769
• Publication Number:
  US 20050214550A1
• Time in Patent Office: Days
• US Class Current: 428/457
• CPC Class Codes: C23C 18/1608 from pretreatment step, i.e. selective pre-treatment
• CPC Class Codes: C23C 18/1612 through irradiation means
• CPC Class Codes: C23C 18/1653 Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
• CPC Class Codes: C23C 18/1868 Radiation, e.g. UV, laser
• CPC Class Codes: C23C 18/1893 with use of organic or inorganic compounds other than metals, first
• CPC Class Codes: C23C 18/2006 by other methods than those of C23C18/22 - C23C18/30
• CPC Class Codes: C23C 18/204 Radiation, e.g. UV, laser
• CPC Class Codes: C23C 18/2086 with use of organic or inorganic compounds other than metals, first
• CPC Class Codes: C23C 18/405 Formaldehyde
• CPC Class Codes: C23C 18/44 using reducing agents
• CPC Class Codes: C23C 18/50 with alloys based on iron, cobalt or nickel
• CPC Class Codes: G03F 7/028 with photosensitivity-increasing substances, e.g. photoinitiators
• CPC Class Codes: G03F 7/029 Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
• CPC Class Codes: G03F 7/031 Organic compounds not covered by group G03F7/029
• CPC Class Codes: G03F 7/0955 one of the photosensitive systems comprising a non-macromolecular photopolymerisable compound having carbon-to-carbon double bonds, e.g. ethylenic compounds
• CPC Class Codes: G03F 7/165 Monolayers, e.g. Langmuir-Blodgett
• CPC Class Codes: G03F 7/2022 Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
• CPC Class Codes: G03F 7/265 Selective reaction with inorganic or organometallic reagents after image-wise exposure, e.g. silylation
• CPC Class Codes: H05K 3/185 by making a catalytic pattern by photo-imaging
• CPC Class Codes: H05K 3/389 by the use of a coupling agent, e.g. silane
• CPC Class Codes: Y10T 428/31678 : Of metal

Abstract

A method of forming a pattern comprising: binding a compound having a substrate binding site and a photopolymerization initiation site capable of initiating radical polymerization by photocleavage thereof, to a surface of a substrate; subjecting the surface to a pattern exposure so as to inactivate the photopolymerization initiation site in the exposed region; bringing a radical polymerizable unsaturated compound into contact with the surface; and subjecting the surface to entire-surface exposure so as to cause a photochemical cleavage of the photopolymerization initiation site remaining in the region which was not exposed in the pattern exposure, wherein the cleavage of the photopolymerization initiation site initiates radical polymerization to form a graft polymer. Also provided are a conductive pattern forming method and a conductive patterned material using the pattern forming method.

Claims

1. A method of forming a pattern comprising:

binding a compound having a substrate binding site and a photopolymerization initiation site capable of initiating radical polymerization by photocleavage thereof, to a surface of a substrate;

subjecting the surface to a pattern exposure so as to inactivate the photopolymerization initiation site in the exposed region;

bringing a radical polymerizable unsaturated compound into contact with the surface; and

subjecting the surface to entire-surface exposure so as to cause a photochemical cleavage of the photopolymerization initiation site remaining in the region which was not exposed in the pattern exposure,

wherein the cleavage of the photopolymerization initiation site initiates radical polymerization to form a graft polymer.

2. The method of forming a pattern according to claim 1, wherein the polymerization initiation site includes a bond selected from the group consisting of C—

C, C—

N, C—

O, C—

Cl, N—

O and S—

N bonds.

3. A graft polymer patterned material obtained by the method of claim 1.

4. A conductive patterned material obtained by adhering a conductive material to the graft polymer prepared by the method of claim 1.

5. The conductive patterned material according to claim 4, wherein the polymerization initiation site includes a bond selected from the group consisting of C—

C, C—

N, C—

O, C—

Cl, N—

O and S—

N bonds.

6. A method of forming a conductive pattern, comprising:

forming a patterned graft polymer by the method of claim 1, and

adhering a conductive material to the graft polymer.

7. The method of forming a conductive pattern according to claim 6, wherein the polymerization initiation site includes a bond selected from the group consisting of C—

C, C—

N, C—

O, C—

Cl, N—

O and S—

N bonds.

8. A method of forming a conductive pattern, comprising:

forming a patterned graft polymer by the method of claim 1;

adhering a metal ion or a metal salt to the graft polymer; and

depositing the metal by reducing the metal ion or the metal ion in the metal salt.

9. The method of forming a conductive pattern according to claim 8, wherein the polymerization initiation site includes a bond selected from the group consisting of C—

C, C—

N, C—

O, C—

Cl, N—

O and S—

N bonds.

10. A conductive patterned material obtained by the method of claim 8.

11. The conductive patterned material according to claim 9, wherein the polymerization initiation site includes a bond selected from the group consisting of C—

C, C—

N, C—

O, C—

Cl, N—

O and S—

N bonds.

12. A method of forming a conductive pattern, comprising:

forming a graft pattern by the method of claim 1;

adhering an electroless plating catalyst or a precursor thereof to the graft polymer; and

forming a patterned thin metal film by electroless plating.

13. The method of forming a conductive pattern according to claim 12, wherein the polymerization initiation site includes a bond selected from the group consisting of C—

C, C—

N, C—

O, C—

Cl, N—

O and S—

N bonds.

14. The method of forming a conductive pattern according to claim 12, further comprising conducting electroplating subsequent to the electroless plating.

15. A conductive patterned material obtained by the method of claim 12.

16. The conductive patterned material according to claim 15, wherein the polymerization initiation site includes a bond selected from the group consisting of C—

C, C—

N, C—

O, C—

Cl, N—

O and S—

N bonds.

17. A conductive patterned material obtained by:

forming a patterned graft polymer by the method of claim 1;

adhering an electroless plating catalyst or a precursor thereof to the graft polymer;

forming a patterned thin metal film by electroless plating; and

conducting electroless plating on the thin metal film.