Pattern forming method, arranged fine particle pattern forming method, conductive pattern forming method, and conductive pattern material
First Claim
1. A pattern forming method comprising:
- bonding a compound to a substrate, the compound having both a polymerization initiating moiety capable of undergoing photocleavage to initiate radical polymerization and a substrate bonding moiety, and contacting a radical-polymerizable unsaturated compound with the substrate, and exposing light thereto patternwise, so as to form a region where a graft polymer is generated and a region where a graft polymer is not generated.
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Abstract
The present invention provides a pattern forming method comprising bonding a compound to a substrate, the compound having both a polymerization initiating moiety capable of undergoing photocleavage to initiate radical polymerization and a substrate bonding moiety, contacting a radical-polymerizable unsaturated compound with the substrate, and exposing light thereto patternwise, so as to form a region where a graft polymer is generated and a region where a graft polymer is not generated. A conductive pattern forming method applying the pattern forming method, and a conductive pattern material obtained by the conductive film forming method.
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Citations
14 Claims
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1. A pattern forming method comprising:
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bonding a compound to a substrate, the compound having both a polymerization initiating moiety capable of undergoing photocleavage to initiate radical polymerization and a substrate bonding moiety, and contacting a radical-polymerizable unsaturated compound with the substrate, and exposing light thereto patternwise, so as to form a region where a graft polymer is generated and a region where a graft polymer is not generated. - View Dependent Claims (2, 3)
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4. An arranged fine particle pattern forming method comprising:
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bonding a compound to a substrate, the compound having both a polymerization initiating moiety capable of undergoing photocleavage to initiate radical polymerization and a substrate bonding moiety, contacting a radical-polymerizable unsaturated compound with the substrate, and exposing light thereto patternwise, so as to form a region where a graft polymer is generated and a region where a graft polymer is not generated, and adhering fine particles to the region where the graft polymer is generated. - View Dependent Claims (5, 6, 7)
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8. A conductive pattern forming method comprising:
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bonding a compound to a substrate, the compound having both a polymerization initiating moiety capable of undergoing photocleavage to initiate radical polymerization and a substrate bonding moiety, contacting a radical-polymerizable unsaturated compound with the substrate, and exposing light thereto patternwise, so as to form a region where a graft polymer is generated and a region where a graft polymer is not generated, providing a metal ion or a metal salt to the region where the graft polymer is generated, and reducing the metal ion or a metal ion in the metal salt to deposit a metal. - View Dependent Claims (9, 10, 11)
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12. A conductive pattern forming method comprising:
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bonding a compound to a substrate, the compound having both a polymerization initiating moiety capable of undergoing photocleavage to initiate radical polymerization and a substrate bonding moiety, contacting a compound, that has both a radical-polymerizable functional group and a functional group that interacts with either an electroless plating catalyst or a precursor thereof, with the substrate, and exposing light thereto patternwise, so as to form a region where a graft polymer is generated and a region where a graft polymer is not generated, providing an electroless plating catalyst or a precursor thereof to the region where the graft polymer is generated, and carrying out electroless plating to form a patterned thin metal layer. - View Dependent Claims (13, 14)
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Specification