Fluid assisted cryogenic cleaning
First Claim
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1. A process for the removal of contaminants from a surface of a substrate requiring precision cleaning, comprising:
- (a) applying at least one fluid to the substrate surface, the fluid selected from the group consisting of a high vapor pressure liquid, a reactive gas, and vapor of a reactive liquid; and
(b) cryogenically cleaning the surface of the substrate.
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Abstract
The present invention is directed to fluid assisted cryogenic cleaning of a substrate surface requiring precision cleaning such as semiconductors, metals, and dielectric films. The process comprises the steps of applying a fluid selected from the group consisting of high vapor pressure liquids, reactive gases, and vapors of reactive liquids onto the substrate surface followed by or simultaneously with cryogenic cleaning of the substrate surface to remove contaminants.
55 Citations
21 Claims
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1. A process for the removal of contaminants from a surface of a substrate requiring precision cleaning, comprising:
- (a) applying at least one fluid to the substrate surface, the fluid selected from the group consisting of a high vapor pressure liquid, a reactive gas, and vapor of a reactive liquid; and
(b) cryogenically cleaning the surface of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
- (a) applying at least one fluid to the substrate surface, the fluid selected from the group consisting of a high vapor pressure liquid, a reactive gas, and vapor of a reactive liquid; and
Specification