Selective processing of microelectronic workpiece surfaces

• US 20050217707A1
• Filed: 05/21/2005
• Published: 10/06/2005
• Est. Priority Date: 03/13/1998
• Status: Abandoned Application

• Current Assignee: Brian K. Aegerter, Curt T. Dundas, Gary L. Curtis, Michael Jolley, Tom L. Ritzdorf
• Original Assignee: Brian K. Aegerter, Curt T. Dundas, Gary L. Curtis, Michael Jolley, Tom L. Ritzdorf
• Inventors: Dundas, Curt T., Jolley, Michael, Ritzdorf, Tom L., Aegerter, Brian K., Curtis, Gary L.
• Application Number:
  US11/133,909
• Publication Number:
  US 20050217707A1
• Time in Patent Office: Days
• US Class Current: 134/33
• CPC Class Codes: H01L 21/31111 by chemical means
• CPC Class Codes: H01L 21/32134 by liquid etching only
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles
• CPC Class Codes: H01L 21/6708 using mainly spraying means, e.g. nozzles

Abstract

A processing fluid is selectively applied or excluded from an outer peripheral margin of the front side, back side, or both sides of a workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece as the workpiece is spinning. The flow rate of the one or more processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

Claims

1. Processing a microelectronic workpiece having a first side, a second side, and an edge, and a barrier layer on the second side and the edge of the workpiece, and a seed layer on the barrier layer, comprising:

applying a metal layer on at least part of the seed layer;

rotating the workpiece;

providing a liquid including an acid and an oxidizing agent onto an outer margin of the second side of the workpiece and onto the edge of the workpiece, with the liquid removing the seed layer from the outer margin and edge of the workpiece.

2. The process of claim 1 wherein the liquid comprises de-ionized water.

3. The process of claim 2 wherein the oxidizer comprises hydrogen peroxide.

4. The process of claim 2 wherein the oxidizer comprises dissolved ozone.

5. The process of claim 2 wherein the acid comprises hydrofluoric acid.

6. The process of claim 3 wherein the acid comprises hydrofluoric acid.

7. The process of claim 2 wherein the acid comprises sulfuric acid, hydrochloric acid, or nitric acid.

8. The process of claim 2 wherein the liquid comprises ammonium persulfate or ammonium fluoride

9. The process of claim 1 wherein the seed layer comprises copper.

10. The process of claim 9 wherein the workpiece comprises a silicon wafer.

11. The process of claim 2 with the liquid comprising:

a mixture of hydrofluoric acid and a surfactant;

or

a mixture of hydrofluoric and hydrochloric acids, or

a mixture of nitric and hydrofluoric acids;

or

a dry etch residue removal solution.

12. The process of claim 1 wherein the metal layer comprises copper, a copper alloy, zinc, chromium, tin, gold, silver, lead, cadmium, platinum, palladium, iridium, cobalt or rubidium.

13. The process of claim 1 wherein the outer margin extends 1-5 mm in from the edge.

14. The process of claim 2 wherein the metal layer is applied onto the seed layer over the outer margin, and wherein the liquid also removes the metal layer from the outer margin.

15. The process of claim 14 wherein the metal layer is also applied onto the seed layer at the edge of the workpiece, and wherein the liquid also removes the metal layer from the edge.

16. The process of claim 1 wherein the liquid removes any metal layer present at the outer margin and at the edge, and also removes the seed layer from outer margin and the edge, and where the liquid does not remove the barrier layer from the outer margin or the edge.

17. A method for processing a workpiece having two sides and an edge, and with a barrier layer on the workpiece, and with a seed layer on the barrier layer including on the edge of the workpiece, comprising:

plating a metal film onto the seed layer;

spinning the workpiece;

applying a liquid including de-ionized water, and an acid, and an oxidizer, to one side of the workpiece, with liquid flowing around the edge and onto the other side of the workpiece;

with the liquid removing the seed layer, and any metal film on the seed layer, at an outer margin and at the edge of the workpiece.

18. The method of claim 17 wherein the acid comprises hydrofluoric acid.

19. The method of claim 17 wherein the workpiece has a first side and a second side, and the outer margin is on the first side of the workpiece, and the liquid contacts the outer margin, the edge, and substantially the entire second side of the workpiece.

20. The method of claim 17 wherein the liquid is applied directly onto the outer margin.

21. Processing a microelectronic workpiece having a first side, a second side, and an edge, and a barrier layer on the second side and the edge of the workpiece, and a seed layer on substantially the entire barrier layer, comprising:

applying a metal layer onto the seed layer over substantially the entire the second side of the workpiece;

rotating the workpiece;

providing a liquid including an acid and an oxidizing agent onto an outer margin of the second side of the workpiece and onto the edge of the workpiece, with the liquid removing the seed layer and the metal layer from the outer margin, and the liquid removing the seed layer from the edge of the workpiece.

22. The process of claim 21 wherein the metal layer is also applied onto the seed layer over the edge of the workpiece, and with the liquid also removing the metal layer from the edge.

23. The process of claim 21 wherein the acid comprises hydrofluoric acid and the oxidizing agent comprises ozone.