Integrated circuit heat pipe heat spreader with through mounting holes
5 Assignments
0 Petitions
Accused Products
Abstract
A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink is provided. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles so as to form a network of capillary passageways between the particles of the wick.
86 Citations
69 Claims
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1-41. -41. (canceled)
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42. A heat pipe for spreading heat comprising:
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a boundary structure including spaced-apart first and second plates that define an enclosed vapor chamber having a capillary structure comprising a plurality of particles joined together by a brazing compound such that fillets of said brazing compound are formed between adjacent ones of said plurality of particles so as to form a network of capillary passageways between said particles;
at least one opening defined by a surrounding portion of said first plate which is bonded to said second plate so that said opening is isolated from said vapor chamber. - View Dependent Claims (43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55)
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56. A heat pipe for spreading heat comprising:
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a boundary structure including spaced-apart first and second plates that define an enclosed vapor chamber having a capillary structure comprising a plurality of particles joined together by a brazing compound such that fillets of said brazing compound are formed between adjacent ones of said plurality of particles so as to form a network of capillary passageways between said particles;
at least one opening defined by a surrounding portion of said first plate which is bonded to said second plate so that said opening is isolated from said vapor chamber; and
at least one post formed on said second plate which projects into said vapor chamber and is bonded to said first plate. - View Dependent Claims (57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69)
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Specification