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Low-profile thermosyphon-based cooling system for computers and other electronic devices

  • US 20050217829A1
  • Filed: 03/23/2005
  • Published: 10/06/2005
  • Est. Priority Date: 03/31/2004
  • Status: Active Grant
First Claim
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1. A thermosyphon cooling device comprising:

  • (a) an evaporator having a length between about 0.75 inches and about 2.0 inches, a width between about 0.75 inches and about 2.0 inches, and a height between about 0.5 inches and about 1.0 inches;

    (b) a narrow condenser having a length between about 5.0 inches and about 13.0 inches, a width between about 0.2 inches and about 0.5 inches, and a height between about 1.0 inches and about 1.7 inches;

    (c) a liquid coolant within said evaporator and condenser;

    (d) at least one coolant pipe connecting said evaporator to said condenser, wherein said at least one coolant pipe is at or below the level of said liquid coolant; and

    (e) at least one vapor pipe connecting said evaporator with said condenser, wherein said at least one vapor pipe is above the level of said liquid coolant.

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