×

Lid assembly for front end of line fabrication

  • US 20050218507A1
  • Filed: 05/24/2005
  • Published: 10/06/2005
  • Est. Priority Date: 02/26/2004
  • Status: Active Grant
First Claim
Patent Images

1. A lid assembly for semiconductor processing, comprising:

  • a first electrode comprising an expanding section that has a gradually increasing inner diameter; and

    a second electrode disposed opposite the first electrode, wherein a plasma cavity is defined between the inner diameter of the expanding section of the first electrode and a first surface of the second electrode.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×