Lid assembly for front end of line fabrication
First Claim
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1. A lid assembly for semiconductor processing, comprising:
- a first electrode comprising an expanding section that has a gradually increasing inner diameter; and
a second electrode disposed opposite the first electrode, wherein a plasma cavity is defined between the inner diameter of the expanding section of the first electrode and a first surface of the second electrode.
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Abstract
A lid assembly for semiconductor processing is provided. In at least one embodiment, the lid assembly includes a first electrode comprising an expanding section that has a gradually increasing inner diameter. The lid assembly also includes a second electrode disposed opposite the first electrode. A plasma cavity is defined between the inner diameter of the expanding section of the first electrode and a first surface of the second electrode.
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Citations
20 Claims
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1. A lid assembly for semiconductor processing, comprising:
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a first electrode comprising an expanding section that has a gradually increasing inner diameter; and
a second electrode disposed opposite the first electrode, wherein a plasma cavity is defined between the inner diameter of the expanding section of the first electrode and a first surface of the second electrode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A lid assembly for semiconductor processing, comprising:
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a first electrode comprising an expanding section having an inner diameter gradually increasing inner diameter;
a second electrode disposed opposite the first electrode, wherein the second electrode comprises a plurality of gas passages formed therethrough and wherein a plasma cavity is defined between the inner diameter of the expanding section of the first electrode and a first surface of the second electrode; and
a perforated plate disposed opposite a second surface of the second electrode, wherein the perforations of the perforated plate are in fluid communication with the plurality of gas passages of the second electrode, wherein;
the second electrode and the perforated plate each comprise a notched outer diameter, and the notched outer diameter of the second electrode is adapted to mount on the notched outer diameter of the perforated plate. - View Dependent Claims (12, 13, 14, 15)
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16. A lid assembly for semiconductor processing, comprising:
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a first electrode comprising an expanding section having a gradually increasing inner diameter;
a second electrode disposed opposite the first electrode, wherein the second electrode comprises a plurality of gas passages formed therethrough and wherein a plasma cavity is defined between the inner diameter of the expanding section of the first electrode and a first surface of the second electrode;
a first perforated plate disposed opposite a second surface of the second electrode; and
a second perforated plate disposed between the second electrode and the first perforated plate, wherein;
the second electrode and the first perforated plate each comprise a notched outer diameter, the notched outer diameter of the second electrode is adapted to mount on the notched outer diameter of the first perforated plate; and
at least a portion of the second perforated plate is adapted to mount to the second surface of the second electrode. - View Dependent Claims (17, 18, 19, 20)
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Specification