Method of manufacturing laminated material for security tag

• US 20050221101A1
• Filed: 03/30/2005
• Published: 10/06/2005
• Est. Priority Date: 03/31/2004
• Status: Abandoned Application

• Current Assignee: Checkpoint Manufacturing Japan Co., Ltd. (CCL Industries Incorporated)
• Original Assignee: Checkpoint Manufacturing Japan Co., Ltd. (CCL Industries Incorporated)
• Inventors: Yamada, Kazunori, Ushino, Shun-ichi, Katagiri, Kaoru, Sasaki, Shogo
• Application Number:
  US11/095,896
• Publication Number:
  US 20050221101A1
• Time in Patent Office: Days
• US Class Current: 428/458
• CPC Class Codes: B32B 15/08 of synthetic resin
• CPC Class Codes: B32B 15/18 comprising iron or steel B32B15/011, B32B15/012 and B32B15/013 take precedence
• CPC Class Codes: B32B 15/20 comprising aluminium or copper B32B15/016 and B32B15/017 take precedence
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: B32B 27/06 as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to a layer of a particular substance B32B9/045; next to a bituminous or tarry layer B32B11/046; next to a water setting substance layer B32B13/12; next to a metal layer B32B15/08; next to a glass layer B32B17/10; next to a layer formed of natural mineral fibres or particles B32B19/045; next to a wood layer B32B21/08; next to a cellulosic plastic layer B32B23/08; next to a natural or synthetic rubber layer B32B25/08
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 3/022 Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/31681 Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
• CPC Class Codes: Y10T 428/31692 Next to addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31786 Of polyester [e.g., alkyd, etc.]

Abstract

A laminated material suitable for fabricating miniaturized security tags which have the uniform resonance frequency, and security tags obtained by using the laminated material, are provided. A manufacturing method of a laminated material for security tags characterized in that metal foils are laminated on both sides of a previously formed synthetic resin film, and security tags obtained by using the laminated material by the manufacturing method, are provided. Because the lamination is performed on the previously formed resin film, the amount of variation in thickness of the resin film is small, and the thin resin film can be precisely manufactured. Further, because the oriented film has a relatively high strength even for a thin film, the laminated material is easy to be etched for forming a circuit. The security tag obtained by using a previously formed resin film can satisfy both uniformizing the resonance frequency and miniaturizing the security tag simultaneously, and has an excellent performance.

Claims

1. A method of manufacturing a laminated material for a security tag, comprising:

laminating a metal foil on both sides of a synthetic resin film by using or without using an adhesive.

2. The manufacturing method according to claim 1, wherein the synthetic resin film is polyethylene, polypropylene, polyester, polyamide, polyimide, cyclic olefin copolymer or polystyrene.

3. The manufacturing method according to claim 1, wherein the adhesive is a urethane adhesive, an acrylic adhesive, a polyether-based adhesive, a polyester adhesive, an poly alkyl imine-based adhesive, a polyethylene adhesive, or an alkyl titanate-based adhesive.

4. The manufacturing method according to claim 1, wherein the metal foil is a silver foil, a copper foil, an aluminum foil, a lead foil, a nickel silver foil, or a stainless steel foil.

5. A security tag obtained by using a laminated material obtained by a manufacturing method according to claim 1.

6. A security tag obtained by using a laminated material obtained by a manufacturing method according to claim 2.

7. A security tag obtained by using a laminated material obtained by a manufacturing method according to claim 3.

8. A security tag obtained by using a laminated material obtained by a manufacturing method according to claim 4.