Substrate support for in-situ dry clean chamber for front end of line fabrication

• US 20050221552A1
• Filed: 05/24/2005
• Published: 10/06/2005
• Est. Priority Date: 02/26/2004
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Kao, Chien-Teh, Lu, Xinliang, Huston, Joel M., Chang, Mei, Chang, Yu, Wang, Wei W., Phan, See-Eng, Trinh, Son, Yuan, Xiaoxiong (John), Umotoy, Sal, Chou, Jing-Pei (Connie), Lai, Chiukin (Steven)
• Application Number:
  US11/137,090
• Publication Number:
  US 20050221552A1
• Time in Patent Office: Days
• US Class Current: 438/200
• CPC Class Codes: C23C 14/022 by means of bombardment with energetic particles or radiation
• CPC Class Codes: C23C 14/50 Substrate holders
• CPC Class Codes: C23C 14/541 Heating or cooling of the substrates
• CPC Class Codes: H01J 2237/2001 Maintaining constant desired temperature
• CPC Class Codes: H01J 37/32082 Radio frequency generated discharge H01J37/32357, H01J37/32366, H01J37/32394 and H01J37/32403 take precedence
• CPC Class Codes: H01J 37/32357 Generation remote from the workpiece, e.g. down-stream
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: H01J 37/32522 Temperature
• CPC Class Codes: H01J 37/32541 Shape
• CPC Class Codes: H01J 37/32568 Relative arrangement or disposition of electrodes; moving means
• CPC Class Codes: H01J 37/32862 In situ cleaning of vessels and/or internal parts
• CPC Class Codes: H01L 21/02104 Forming layers deposition in general C23C; crystal growth in general C30B
• CPC Class Codes: H01L 21/67069 for drying etching
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A substrate support assembly and method for supporting a substrate are provided. In at least one embodiment, the support assembly includes a body having one or more fluid conduits disposed therethrough, and a support member disposed on a first end of the body. The support member includes one or more fluid channels formed in an upper surface thereof, wherein each fluid channel is in communication with the one or more of the fluid conduits. The support assembly also includes a cooling medium source in fluid communication with the one or more fluid conduits, and a first electrode having a plurality of holes formed therethrough. The first electrode is disposed on the upper surface of the support member such that each of the plurality of holes is in fluid communication with at least one of the one or more fluid channels formed in the upper surface of the support member.

Claims

1. A substrate support assembly, comprising:

a body having one or more fluid conduits disposed therethrough;

a support member disposed on a first end of the body, the support member having one or more fluid channels formed in an upper surface thereof, wherein each fluid channel is in communication with the one or more of the fluid conduits;

a cooling medium source in fluid communication with the one or more fluid conduits; and

a first electrode having a plurality of holes formed therethrough, the first electrode disposed on the upper surface of the support member such that each of the plurality of holes is in fluid communication with at least one of the one or more fluid channels formed in the upper surface of the support member.

2. The support assembly of claim 1, wherein at least one of the one or more fluid conduits is in fluid communication with a vacuum pump for chucking a substrate to the first electrode.

3. The support assembly of claim 1, wherein at least one of the one or more fluid conduits provides a purge gas to the one or more fluid channels formed in the upper surface of the support member for preventing deposition on a sidewall of the support member.

4. The support assembly of claim 1, wherein at least one of the one or more fluid conduits provides a coolant to the one or more fluid channels formed in the upper surface of the support member for cooling the support member.

5. The support assembly of claim 1, wherein the first electrode is a detachable member that rests on the upper surface of the support member.

6. The support assembly of claim 1, wherein the first electrode includes a plurality of raised dimples disposed on an upper surface thereof to minimize contact with a substrate supported thereon.

7. The support assembly of claim 1, wherein the first electrode is constructed of silicon.

8. The support assembly of claim 1, wherein the first electrode has one or more vertical bores aligned with a bore in the support member for housing a moveable support pin therethrough.

9. The support assembly of claim 8, wherein the one or more vertical bores are lined with a ceramic sleeve to reduce friction with the moveable support pin.

10. The support assembly of claim 1, further comprising an annular ring disposed about an outer perimeter of the support member.

11. The support assembly of claim 10, wherein the annular ring functions to guide a purge gas about the outer perimeter of the support member to prevent deposition thereon.

17. The support assembly of claim 1, wherein the first electrode has one or more bores formed through the first electrode and the support member has corresponding bores for housing a moveable support pin therethrough.

18. The support assembly of claim 17, wherein the one or more bores are lined with a ceramic sleeve to reduce friction with the moveable support pin.

12. A substrate support assembly, comprising:

a body having at least one gas conduit and at least two liquid conduits disposed therethrough;

a support member disposed on a first end of the body, the support member having a channel formed in an upper surface thereof that is in fluid communication with the at least one gas conduit, the support member also having a heat exchange passage formed therein that is in fluid communication with the at least two liquid conduits; and

a first electrode having a plurality of holes formed therethrough, the first electrode disposed on the upper surface of the support member such that each of the plurality of holes is in fluid communication with the channel formed in the upper surface of the support member.

13. The support assembly of claim 12, further comprising an annular ring disposed about an outer perimeter of the support member.

14. The support assembly of claim 13, wherein the annular ring is adapted to guide a purge gas about the outer perimeter of the support member to prevent deposition thereon.

15. The support assembly of claim 12, wherein the first electrode is a detachable member that rests on the upper surface of the support member.

16. The support assembly of claim 12, wherein the first electrode has a recessed upper surface having a plurality of raised dimples to minimize contact with a substrate supported thereon.

19. A method for supporting and cooling a substrate, comprising:

providing a substrate support assembly comprising;

a body having one or more fluid passages disposed therethrough;

a support member disposed on a first end of the body, the support member having one or more fluid channels formed in an upper surface thereof each in fluid in communication with one or more of the fluid passages; and

a first electrode having a plurality of holes formed therethrough, the first electrode disposed on the upper surface of the support member such that each of the plurality of holes is in fluid communication with at least one of the one or more fluid channels;

applying a vacuum to the first electrode for engaging a substrate, wherein the vacuum is applied through the one or more fluid passages formed in the body;

flowing a purge gas to a backside of the substrate through the one or more fluid channels formed in the support member; and

cooling the substrate by flowing a cooling medium through the fluid passage formed within the body.

20. The method of claim 19, further comprising directing the flow of purge gas about an outer perimeter of the support member using a ring member disposed about the outer perimeter of the support member.