Interconnect structure for an integrated circuit and method of fabrication
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Abstract
An interconnect structure for an integrated circuit having several levels of conductors is disclosed. Dielectric pillars for mechanical support are formed between conductors in adjacent layers at locations that do not have vias. The pillars are particularly useful with low-k ILD or air dielectric.
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Citations
21 Claims
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1-10. -10. (canceled)
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11. A method for providing an interconnect structure for an integrated circuit comprising:
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providing a plurality of levels of conductor, one above the other, each having a plurality of parallel, spaced-apart lines, the conductor in any one of the levels being perpendicular to the conductors in the level below it;
providing vias between selected intersections of the lines in one of the levels and the lines in the level directly below it; and
providing dielectric pillars at every intersection of the lines in one level and the lines at the level below it, where such intersections do not have vias. - View Dependent Claims (12)
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13. A method comprising:
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forming a first dielectric layer on first conductors;
forming first openings in the first dielectric layer;
depositing a second dielectric layer on the first dielectric layer so as to fill the first openings;
planarizing the second dielectric layer so as to expose the first dielectric layer and form pillars entirely from the second dielectric layer;
depositing a third dielectric layer on the first dielectric layer;
defining via openings through the first and third dielectric layers exposing underlying first conductors;
forming trenches above the via openings and pillars; and
depositing a conductive material into the via openings and trenches. - View Dependent Claims (14, 15, 16)
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17. A method comprising:
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forming a first dielectric layer on a plurality of spaced-apart first conductors;
masking and etching the first dielectric layer so as to form pillars entirely from the first dielectric layer at predetermined locations on the conductors;
forming a second dielectric layer over the pillars and conductors;
opening vias and trenches in the second dielectric, including trenches disposed above the pillars;
forming a barrier layer so as to line the via openings and trenches;
depositing a conductive layer so as to fill the via openings and trenches;
planarizing the surface of the conductive layer to form second conductors; and
forming shunts over the second conductors. - View Dependent Claims (18, 19, 20, 21)
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Specification