Apparatus and method for depositing thin film on wafer using remote plasma
First Claim
1. A remote-plasma atomic film deposition apparatus comprising:
- a reaction chamber in which wafers are loaded;
an exhaust line for exhausting gas from the reaction chamber;
a first reactive gas supply unit for selectively supplying a first reactive gas to the reactant chamber or the exhaust line;
a first reactive gas transfer line for connecting the first reactive gas supply unit and the reactant chamber;
a first bypass line for connecting the first reactive gas supply line and the exhaust line;
a radical supply unit for generating corresponding radicals by applying plasma to a second reactive gas and then selectively supplying the radicals to the reactant chamber or the exhaust line;
a radical transfer line for connecting the radical supply unit and the reactant chamber;
a second bypass line for connecting the radical supply unit and the exhaust line; and
a main purge gas supply unit for supplying a main purge gas to the first reactant transfer line and/or the radical transfer line.
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Accused Products
Abstract
A remote-plasma ALD apparatus includes a reaction chamber, an exhaust line for exhausting gas from the reaction chamber, a first reactive gas supply unit for selectively supplying a first reactive gas to the reactant chamber or the exhaust line, a first reactive gas transfer line for connecting the first reactive gas supply unit and the reactant chamber, a first bypass line for connecting the first reactive gas supply line and the exhaust line, a radical supply unit for generating radicals and selectively supplying the radicals to the reactant chamber or the exhaust line, a radical transfer line for connecting the radical supply unit and the reactant chamber, a second bypass line for connecting the radical supply unit and the exhaust line, and a main purge gas supply unit for supplying a main purge gas to the first reactant transfer line and/or the radical transfer line.
378 Citations
13 Claims
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1. A remote-plasma atomic film deposition apparatus comprising:
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a reaction chamber in which wafers are loaded;
an exhaust line for exhausting gas from the reaction chamber;
a first reactive gas supply unit for selectively supplying a first reactive gas to the reactant chamber or the exhaust line;
a first reactive gas transfer line for connecting the first reactive gas supply unit and the reactant chamber;
a first bypass line for connecting the first reactive gas supply line and the exhaust line;
a radical supply unit for generating corresponding radicals by applying plasma to a second reactive gas and then selectively supplying the radicals to the reactant chamber or the exhaust line;
a radical transfer line for connecting the radical supply unit and the reactant chamber;
a second bypass line for connecting the radical supply unit and the exhaust line; and
a main purge gas supply unit for supplying a main purge gas to the first reactant transfer line and/or the radical transfer line. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. The method of claim 13, after depositing a thin film, further comprising injecting radicals and an inert gas into the reactant chamber to thermally treat the thin film, wherein the radicals are formed of at least one selected from the group consisting of O, N, H, OH, and NH and a combination thereof.
Specification