×

Method and apparatus for in-situ film stack processing

  • US 20050224181A1
  • Filed: 04/08/2004
  • Published: 10/13/2005
  • Est. Priority Date: 04/08/2004
  • Status: Active Grant
First Claim
Patent Images

1. A processing chamber, comprising:

  • a chamber body;

    a lid disposed on the chamber body and having a gas inlet port;

    a substrate support adapted to support a substrate having a processing side surface area of at least 0.25 square meters;

    a remote plasma source coupled to the gas inlet port;

    a gas distribution plate disposed in the chamber body above the substrate support; and

    an RF power source coupled to at least one of the gas distribution plate and substrate support.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×