Electrochemical deposition analysis system including high-stability electrode

• US 20050224370A1
• Filed: 04/07/2004
• Published: 10/13/2005
• Est. Priority Date: 04/07/2004
• Status: Abandoned Application

• Current Assignee: Advanced Technology Materials, Inc. (Entegris Incorporated)
• Original Assignee: Advanced Technology Materials, Inc. (Entegris Incorporated)
• Inventors: Liu, Jun, King, Mackenzie
• Application Number:
  US10/819,765
• Publication Number:
  US 20050224370A1
• Time in Patent Office: Days
• US Class Current: 205/794
• CPC Class Codes: G01N 27/42 Measuring deposition or liberation of materials from an electrolyte; Coulometry, i.e. measuring coulomb-equivalent of material in an electrolyte

Abstract

A system and method for determining concentration of one or more components of interest in a copper electroplating solution, involving repetitive electroplating and stripping of copper, in which a ruthenium electrode is employed as a substrate for such electroplating and stripping steps. The concentration determination may be carried out by pulsed cyclic galvanostatic analysis (PCGA) or other methodology, to determine levels or accelerator and/or suppressor components of the plating bath chemistry.

Claims

1. A system for determining concentrations of organic components in plating compositions for electrochemical deposition of copper, said system comprising a measurement chamber having disposed therein a ruthenium electrode having a plating surface on which copper is depositable by electroplating and from which deposited copper is strippable, in respective deposition and stripping steps of an operational cycle of said system when the measurement chamber contains an electrolyte solution, and electrical circuitry operatively coupled with the ruthenium electrode and arranged for conducting said operational cycle of the system.

2. The system of claim 1, wherein said electrical circuitry comprises an electroplating current source electrode in said measurement chamber.

3. The system of claim 2, wherein said electrical circuitry further comprises a reference electrode positioned in a reference chamber arranged to receive a base copper plating solution.

4. The system of claim 3, wherein said electrical circuitry comprises driving electronics electrically and operationally coupled between the ruthenium electrode and the electroplating current source electrode, whereby copper is selectively depositable on the ruthenium electrode at a constant or known current density when the measurement chamber contains a copper plating solution as the electrolyte solution therein.

5. The system of claim 4, wherein said electrical circuitry comprises electrical potential measuring circuitry electrically and operatively coupled between the ruthenium electrode and the reference electrode, whereby electrical potential is measured and recorded.

6. The system of claim 3, wherein said electrical circuitry is constructed and arranged to carry out PCGA determinations of plating solution additives.

7. The system of claim 6, wherein said additives are selected from the group consisting of electrodeposition accelerators, suppressors and levelers.

8. The system of claim 1, wherein the ruthenium electrode comprises substantially pure ruthenium.

9. The system of claim 1, wherein the ruthenium electrode is formed of a ruthenium alloy containing at least 80% ruthenium.

10. The system of claim 1, wherein the ruthenium electrode has a microelectrode conformation, with a diameter in a range of from about 1 μ

m to about 200 μ

m.

11. A method of determining concentrations of organic components in plating compositions for electrochemical deposition of copper, said method comprising:

providing a system including a measurement chamber having disposed therein a ruthenium electrode having a plating surface on which copper is depositable by electroplating and from which deposited copper is strippable, in respective deposition and stripping steps of an operational cycle of said system when the measurement chamber contains an electrolyte solution, and electrical circuitry operatively coupled with the ruthenium electrode and arranged for conducting said operational cycle of the system;

introducing electrolyte solution and plating composition components into said measurement chamber as required for said operational cycle; and

actuating said electrical circuitry to conduct said operational cycle.

12. The method of claim 11, wherein the operational cycle includes repetitive plating and stripping steps.

13. The method of claim 11, wherein the operational cycle includes PCGA operation.

14. The method of claim 13, wherein said PCGA operation determines concentration of plating bath additives.

15. The method of claim 14, wherein said additives are selected from the group consisting of electrodeposition accelerators, suppressors and levelers.

16. The method of claim 14, wherein said additives includes accelerator and suppressor additives.

17. A method of plating and stripping copper to determine concentration of a component of interest in a copper electroplating solution, said method comprising using a ruthenium electrode as a copper deposition and stripping substrate.

18. The method of claim 17, wherein copper is plated on the ruthenium electrode by electrodeposition including under-potential deposition of copper.

19. A method of maintaining stable operation in a system for determining concentration of one or more components of interest in a copper electroplating solution, involving repetitive electroplating and stripping of copper, said method comprising using a ruthenium electrode as a substrate for said electroplating and stripping of copper.

20. The method of claim 19, wherein the ruthenium electrode has a microelectrode conformation.

21. The method of claim 19, wherein the ruthenium electrode does not exceed an operating potential of 0.8 volts.